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公开(公告)号：US20240318034A1
公开(公告)日：2024-09-26
申请号：US18580568
申请日：2022-07-20
发明人： Gyeong Hyeon RO , Gyeong Min MOON , Ik Sang LEE
IPC分类号： C09D179/08 , C08G73/10 , C08K5/544 , C08L79/08
CPC分类号： C09D179/08 , C08G73/1017 , C08G73/1042 , C08G73/1071 , C08L79/08 , C08K5/544 , C08L2203/202
摘要： The present invention relates to a polyamic acid composition for coating a conductor, and provides a polyamic acid composition for coating a conductor that prevents dielectric breakdown and partial discharge of a cured product while improving adhesion between a conductor and a coating material and flexibility of the coating material.
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公开(公告)号：US20240228792A1
公开(公告)日：2024-07-11
申请号：US18561280
申请日：2022-05-17
发明人： Gyeong Hyeon RO , Ik Sang LEE
摘要： The present application provides; a varnish, which is a polyimide precursor that is imidized by thermal curing, and implements the insulation, adhesion, heat resistance, mechanical strength, and light resistance of polyimide; a film including same; and a vehicle device coated with the film.
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公开(公告)号：US20240204194A1
公开(公告)日：2024-06-20
申请号：US18287642
申请日：2022-04-22
发明人： Se Joo PARK , In Hwan HWANG , Ik Sang LEE
摘要： The present application relates to a polyamic acid composition, a binder resin composition for an electrode, an electrode active material composition comprising the binder resin composition, and an electrode comprising same, and provides a novel binder material which has excellent mechanical strength and excellent binding force by synthesizing polyamic acid and applying same as a silicone-based negative electrode binder.
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公开(公告)号：US20240018307A1
公开(公告)日：2024-01-18
申请号：US18037894
申请日：2020-11-27
发明人： In Hwan HWANG , Ik Sang LEE
IPC分类号： C08G73/10
CPC分类号： C08G73/1067 , C08G73/1032
摘要： The present application relates to a polyamic acid composition and a polyimide comprising same, and provides a polyamic acid composition which has a high concentration of polyamic acid solids and a low viscosity and, after hardening, has superior electrical properties as well as superior heat resistance, dimensional stability, and mechanical properties, and a polyimide and a polyimide film produced therefrom.
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公开(公告)号：US20240002600A1
公开(公告)日：2024-01-04
申请号：US18037862
申请日：2020-11-27
发明人： In Hwan HWANG , Ik Sang LEE
CPC分类号： C08G73/1067 , C08J5/18 , C08K3/36 , C08G73/1032
摘要： The present application relates to a polyamic acid composition and a polyimide comprising same, and provides a polyamic acid composition which has a high concentration of polyamic acid solids and a low viscosity and, after hardening, has superior heat resistance, dimensional stability, and mechanical properties, and a polyimide and a polyimide film produced therefrom.
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公开(公告)号：US20240110010A1
公开(公告)日：2024-04-04
申请号：US18253979
申请日：2020-12-28
发明人： Ho Sung LEE , Ik Sang LEE , Jin Seok JEON
IPC分类号： C08G73/10
CPC分类号： C08G73/1032 , C08G73/1071 , B29K2105/251
摘要： The present invention relates to a method for producing a polyimide powder, particularly to a method for producing a polyimide powder, which includes a) preparing a dispersion by dispersing a dianhydride and a diamine in distilled water; and b) introducing the dispersion of step a) into a reactor and conducting the reaction at a stirring speed of 300 rpm or more under temperature and pressure conditions. In the present invention, it is possible to improve physical properties and control the particle size and dispersibility without additional processes by using water-based polymerization and controlling the stirring speed in the production process.
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公开(公告)号：US20230416465A1
公开(公告)日：2023-12-28
申请号：US18037874
申请日：2020-11-27
发明人： In Hwan HWANG , Ik Sang LEE
CPC分类号： C08G73/1067 , C08G73/1032 , C08K3/40 , C08L79/08 , C08J5/18 , C08K2201/003 , C08L2201/08 , C08L2203/16 , C08L2203/20
摘要： The present application relates to a polyamic acid composition and a polyimide comprising same, and provides a polyamic acid composition which has a high concentration of polyamic acid solids and a low viscosity and, after hardening, has superior heat resistance, dimensional stability, and mechanical properties, and a polyimide and a polyimide film produced therefrom.
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公开(公告)号：US20230416464A1
公开(公告)日：2023-12-28
申请号：US18037839
申请日：2020-11-27
发明人： In Hwan HWANG , Ik Sang LEE
CPC分类号： C08G73/1067 , C08G73/1032 , C08K3/40 , C08L79/08 , C08J5/18 , C08K2201/003 , C08L2201/08 , C08L2203/16 , C08L2203/20
摘要： The present application relates to a polyamic acid composition and a polyimide comprising same, and provides a polyamic acid composition which has a high concentration of polyamic acid solids and a low viscosity and, after hardening, has superior heat resistance, dimensional stability, and mechanical properties, and a polyimide and a polyimide film produced therefrom.
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公开(公告)号：US20240150611A1
公开(公告)日：2024-05-09
申请号：US18380434
申请日：2023-10-16
发明人： Min Seok YANG , Ho Sung LEE , Ik Sang LEE
IPC分类号： C09D179/08 , C08G73/10 , C08J3/12 , C08K3/04 , C09D17/00
CPC分类号： C09D179/08 , C08G73/1032 , C08G73/1042 , C08G73/1071 , C08J3/12 , C08K3/04 , C09D17/002 , C08K2201/001
摘要： The present application provides a polyimide powder in which a conductive filler is uniformly dispersed within particles, and a polyamic acid varnish that is prepared from the powder and capable of implementing a polyimide molded article that not only has excellent moldability and processability, but also has excellent conductivity, tensile strength, elongation, and elastic modulus.
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公开(公告)号：US20240002601A1
公开(公告)日：2024-01-04
申请号：US18037888
申请日：2020-11-27
发明人： In Hwan HWANG , Ik Sang LEE
IPC分类号： C08G73/10
CPC分类号： C08G73/1067 , C08G73/1032
摘要： The present application relates to a polyamic add composition and a polyimide comprising same, and provides a polyamic add composition which has a high concentration of polyamic acid solids and a low viscosity and, after hardening, has superior electrical properties as well as superior heat resistance, dimensional stability, and mechanical properties, and a polyimide and a polyimide film produced therefrom.
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