发明公开
- 专利标题: SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING SYSTEM HAVING THE SAME
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申请号: US18081325申请日: 2022-12-14
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公开(公告)号: US20230416923A1公开(公告)日: 2023-12-28
- 发明人: Kee Jun KIM , Seung Ho LEE
- 申请人: WONIK IPS CO., LTD.
- 申请人地址: KR Pyeongtaek-si Gyeonggi-do
- 专利权人: WONIK IPS CO., LTD.
- 当前专利权人: WONIK IPS CO., LTD.
- 当前专利权人地址: KR Pyeongtaek-si Gyeonggi-do
- 优先权: KR 20220078901 2022.06.28
- 主分类号: C23C16/54
- IPC分类号: C23C16/54 ; C23C16/458 ; C23C16/44 ; C23C16/52
摘要:
The present invention disclosed herein relates to a substrate processing apparatus and a substrate processing system having the same, and more particularly, to a substrate processing apparatus capable of simultaneously processing a large amount of substrates and a substrate processing system having the same. The present invention discloses a substrate processing apparatus including a first processing module in which substrate processing is performed on a plurality of substrates, a second processing module disposed adjacent to the first processing module to perform the substrate processing on the plurality of substrates, a first utility part disposed adjacent to a rear surface of the first processing module, a second utility part disposed adjacent to a rear surface of the second processing module, and an upper support part provided between the first utility part and the second utility part to divide the maintenance space into an upper area and a lower area.
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