公开(公告)号：US20230416917A1

公开(公告)日：2023-12-28

申请号：US18081263

申请日：2022-12-14

申请人： WONIK IPS CO., LTD.

发明人： Kee Jun KIM ,  Seung Han KIM ,  Bong Su CHOI ,  Sang Cheol PARK

IPC分类号： C23C16/455

CPC分类号： C23C16/45578

摘要： The present invention disclosed herein relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus capable of performing substrate processing such as deposition, etching, and heat processing on a plurality of substrates. The present invention discloses a substrate processing apparatus including a reaction tube having a processing space, in which a plurality of substrates are accommodated to perform substrate processing, a nozzle installation part protruding outward from a portion of a side surface of the reaction tube to provide a portion of an outer surface of the reaction tube, and a plurality of gas injection nozzles disposed along a circumference of each of the substrate in a direction perpendicular to the nozzle installation part to inject a process gas into the reaction tube, wherein the nozzle installation part comprises a plurality of insertion parts corresponding to the gas injection nozzles.

公开(公告)号：US20230416923A1

公开(公告)日：2023-12-28

申请号：US18081325

申请日：2022-12-14

申请人： WONIK IPS CO., LTD.

发明人： Kee Jun KIM ,  Seung Ho LEE

IPC分类号： C23C16/54 ,  C23C16/458 ,  C23C16/44 ,  C23C16/52

CPC分类号： C23C16/54 ,  C23C16/458 ,  C23C16/4412 ,  C23C16/52

摘要： The present invention disclosed herein relates to a substrate processing apparatus and a substrate processing system having the same, and more particularly, to a substrate processing apparatus capable of simultaneously processing a large amount of substrates and a substrate processing system having the same. The present invention discloses a substrate processing apparatus including a first processing module in which substrate processing is performed on a plurality of substrates, a second processing module disposed adjacent to the first processing module to perform the substrate processing on the plurality of substrates, a first utility part disposed adjacent to a rear surface of the first processing module, a second utility part disposed adjacent to a rear surface of the second processing module, and an upper support part provided between the first utility part and the second utility part to divide the maintenance space into an upper area and a lower area.