A pattern fuse includes a lower film layer, an adhesive layer stacked on the lower film layer, a circuit pattern made of a conductive material and provided on the adhesive layer, an upper film layer stacked on the adhesive layer and the circuit pattern and a coating layer configured to cover the opening of the upper film layer, wherein the coating layer includes a flame retardant material. The upper film layer has an opening formed therein that is configured to allow a part or the entirety of the circuit pattern to be exposed therethrough. A method of manufacturing the pattern fuse is also provided.