- 专利标题: CURABLE COMPOSITION
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申请号: US17786692申请日: 2020-10-26
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公开(公告)号: US20230054785A1公开(公告)日: 2023-02-23
- 发明人: Daisuke ITO
- 申请人: DAICEL CORPORATION
- 申请人地址: JP Osaka-shi, Osaka
- 专利权人: DAICEL CORPORATION
- 当前专利权人: DAICEL CORPORATION
- 当前专利权人地址: JP Osaka-shi, Osaka
- 优先权: JP2019-229221 20191219
- 国际申请: PCT/JP2020/040077 WO 20201026
- 主分类号: C08F22/40
- IPC分类号: C08F22/40 ; C08K5/14 ; C08L35/00 ; C09D135/00 ; C09J135/00
摘要:
Provided is a curable composition having excellent workability and being capable of forming a cured product having super heat resistance by curing. The curable composition of the present disclosure includes a curable compound represented by Formula (1) below and a radical polymerization initiator. In the following formula, R1 and R2 each represent a curable functional group, and D1 and D2 each represent a single bond or a linking group. L represents a divalent group having a repeating unit containing a structure represented by Formula (I) below and a structure represented by Formula (II) below. Ar1 to A3 each represent an arylene group or a group in which two or more arylene groups are bonded via a single bond or a linking group. X represents —CO—, —S—, or —SO2—, and Y represents —S—, —SO2—, —O—, —CO—, —COO—, or —CONH—. n represents an integer of 0 or greater.
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