公开(公告)号：US20250034385A1

公开(公告)日：2025-01-30

申请号：US18834883

申请日：2023-01-31

Applicant: DAICEL CORPORATION

Inventor： Daisuke ITO ,  Shinsuke ISHIKAWA ,  Yuichi FUJIOKA ,  Mitsuteru MUTSUDA ,  Tomoki KITAGAWA

IPC: C08L23/20 ,  C08K5/14 ,  C08L9/06 ,  C08L53/02 ,  H05K1/03

Abstract: The present disclosure provides a thermosetting resin composition and the like, from which is obtained a cured product that excels in dielectric properties with respect to high-frequency radio waves. The thermosetting resin composition and the like of the present disclosure contain a thermosetting resin having a plurality of ethylenically unsaturated groups per molecule. The ethylenically unsaturated groups are carbon-carbon double bonds each containing two carbon atoms. A percentage of a number of ethylenically unsaturated groups in which both of the two carbon atoms are bonded to one or two atoms other than a hydrogen atom by single bonds is 50% or greater, with proviso that the total number of the ethylenically unsaturated groups is 100%. Alternatively, a dielectric loss tangent at 40 GHz of a cured product of the thermosetting resin composition is smaller than a dielectric loss tangent at 10 GHz of the cured product.

公开(公告)号：US20230054785A1

公开(公告)日：2023-02-23

申请号：US17786692

申请日：2020-10-26

Applicant: DAICEL CORPORATION

Inventor： Daisuke ITO

IPC: C08F22/40 ,  C08K5/14 ,  C08L35/00 ,  C09D135/00 ,  C09J135/00

Abstract: Provided is a curable composition having excellent workability and being capable of forming a cured product having super heat resistance by curing. The curable composition of the present disclosure includes a curable compound represented by Formula (1) below and a radical polymerization initiator. In the following formula, R1 and R2 each represent a curable functional group, and D1 and D2 each represent a single bond or a linking group. L represents a divalent group having a repeating unit containing a structure represented by Formula (I) below and a structure represented by Formula (II) below. Ar1 to A3 each represent an arylene group or a group in which two or more arylene groups are bonded via a single bond or a linking group. X represents —CO—, —S—, or —SO2—, and Y represents —S—, —SO2—, —O—, —CO—, —COO—, or —CONH—. n represents an integer of 0 or greater.

公开(公告)号：US20210253527A1

公开(公告)日：2021-08-19

申请号：US17254053

申请日：2019-06-10

Applicant: DAICEL CORPORATION

Inventor： Daisuke ITO ,  Tsukasa YOSHIDA ,  Toshihiro TAI ,  Hitomi TAMAOKI ,  Satoru SUMIMOTO

IPC: C07D209/48 ,  C09D139/04 ,  C09D149/00 ,  C09D4/00 ,  C09J139/04 ,  C09J149/00 ,  C09J4/00 ,  C07C225/22 ,  C07D207/452 ,  C09K3/10

Abstract: Provided is a curable compound having a low melting temperature, having excellent workability as a result of having good solvent solubility, and being capable of forming a cured product having excellent heat resistance. The curable compound according to an embodiment of the present invention includes the following characteristics (a) to (e). (a) Number average molecular weight (calibrated with polystyrene standard): 1000 to 15000. (b) Proportion of a structure derived from an aromatic ring in the total amount of the curable compound: 50 wt. % or greater. (c) Solvent solubility at 25° C.: 1 g/100 g or greater. (d) Glass transition temperature: 280° C. or lower. (e) 5% Weight loss temperature (Td5) measured at a rate of temperature increase of 10° C./min (in nitrogen), for a cured product of the curable compound: 300° C. or higher.

公开(公告)号：US20210269593A1

公开(公告)日：2021-09-02

申请号：US17254076

申请日：2019-06-10

Applicant: DAICEL CORPORATION

Inventor： Daisuke ITO ,  Tsukasa YOSHIDA ,  Toshihiro TAI ,  Hitomi TAMAOKI ,  Satoru SUMIMOTO

IPC: C08G65/40 ,  C09D171/10 ,  C09D7/20 ,  C09J171/10 ,  B32B27/08 ,  B32B27/28 ,  B32B37/12

Abstract: Provided is a curable composition having excellent workability and being capable of forming a cured product having excellent heat resistance. The curable composition of the present invention includes a compound represented by Formula (1) below and a solvent: In Formula (1) below, R1 and R2 each represent a curable functional group, and D1 and D2 each represent a single bond or a linking group. L represents a divalent group having a repeating unit containing a structure represented by Formula (I) below and a structure represented by Formula (II) below. In Formula (I) and Formula (II) below, Ar1 to Ar3 each represent a group in which two hydrogen atoms are removed from an aromatic ring structure or a group in which two hydrogen atoms are removed from a structure in which two or more aromatic rings are bonded through a single bond or a linking group. X represents —CO—, —S—, or —SO2—, and Y represents —S—, —SO2—, —O—, —CO—, —COO—, or —CONH—. n represents an integer of 0 or greater.

公开(公告)号：US20160032139A1

公开(公告)日：2016-02-04

申请号：US14780078

申请日：2014-03-26

Applicant: DAICEL CORPORATION

Inventor： Shinji KIKUCHI ,  Daisuke ITO

IPC: C09D163/00 ,  B05D3/00

CPC classification number: C09D163/00 ,  B05D3/007 ,  C08J7/047 ,  C08J2367/02 ,  C08J2463/02 ,  G02B1/105 ,  G02B1/14

Abstract: Provided is a hard coat film including a hard coat layer that has high pencil hardness and high scratch resistance and still offers excellent transparency.The present invention relates to a hard coat film including a plastic substrate and a hard coat layer disposed on or over at least one surface of the plastic substrate. The hard coat layer is formed from a curable composition including 3,4,3′,4′-diepoxybicyclohexyl, at least one selected from the group consisting of hydroxy-containing silicon compounds and silica fillers, and an acid generator.

Abstract translation: 本发明提供一种硬涂膜，其具有铅笔硬度高，耐擦伤性高的硬涂层，透明性优异。 本发明涉及一种硬涂膜，其包括塑料基板和设置在塑料基板的至少一个表面上或之上的硬涂层。 硬涂层由包含3,4,3'，4'-二环氧双环己基，选自含羟基的硅化合物和二氧化硅填料中的至少一种和酸产生剂的可固化组合物形成。