A surface mounted assembly is provided and includes a surface mounted device, a cable and a circuit board. The circuit board includes a first outer side and a second outer side opposite to first outer side, and a conductive hole structure. The cable is inserted into the conductive hole structure from the first outer side of the circuit board and affixed with and electrically connected to the conductive hole structure to locate a terminal of the cable between the first outer side and the second outer side of the circuit board. The surface mounted device is mounted on the second outer side of the circuit board. An electrical connecting component of the surface mounted device and the terminal of the cable are affixed with and electrically connected to the conductive hole structure and electrically connected to each other by the conductive hole structure. Furthermore, an endoscope is provided.