Invention Application
- Patent Title: PHOTONIC INTEGRATED CIRCUIT TO GLASS SUBSTRATE ALIGNMENT THROUGH DUAL CYLINDRICAL LENS
-
Application No.: US17476120Application Date: 2021-09-15
-
Publication No.: US20230077939A1Publication Date: 2023-03-16
- Inventor: Changhua Liu , Pooya Tadayon , John Heck , Srikant Nekkanty
- Applicant: Changhua Liu , Pooya Tadayon , John Heck , Srikant Nekkanty
- Applicant Address: US AZ Chandler; US OR Portland; US CA Berkeley; US AZ Chandler
- Assignee: Changhua Liu,Pooya Tadayon,John Heck,Srikant Nekkanty
- Current Assignee: Changhua Liu,Pooya Tadayon,John Heck,Srikant Nekkanty
- Current Assignee Address: US AZ Chandler; US OR Portland; US CA Berkeley; US AZ Chandler
- Main IPC: G02B6/42
- IPC: G02B6/42
![PHOTONIC INTEGRATED CIRCUIT TO GLASS SUBSTRATE ALIGNMENT THROUGH DUAL CYLINDRICAL LENS](/abs-image/US/2023/03/16/US20230077939A1/abs.jpg.150x150.jpg)
Abstract:
An electronic device comprises a photonic integrated circuit (PIC) including at least one optical signal source, an emitting lens disposed on the PIC to steer light emitted by the at least one optical signal source in a direction substantially parallel to a first surface of the PIC, and an optical element disposed on the PIC and having a curved surface in a shape of a quarter cylinder that is configured to steer light emitted from the emitting lens in a direction substantially orthogonal to the first surface of the PIC.
Information query