发明申请
- 专利标题: FIELD-EFFECT TRANSISTOR AND METHOD FOR MANUFACTURING FIELD-EFFECT TRANSISTOR
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申请号: US17667641申请日: 2022-02-09
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公开(公告)号: US20230079309A1公开(公告)日: 2023-03-16
- 发明人: NOBUYUKI SHIRAI , NOBUYOSHI MATSUURA
- 申请人: WILL SEMICONDUCTOR (SHANGHAI) CO. LTD.
- 申请人地址: CN Shanghai
- 专利权人: WILL SEMICONDUCTOR (SHANGHAI) CO. LTD.
- 当前专利权人: WILL SEMICONDUCTOR (SHANGHAI) CO. LTD.
- 当前专利权人地址: CN Shanghai
- 优先权: JP2021-151414 20210916
- 主分类号: H01L29/423
- IPC分类号: H01L29/423 ; H01L29/66 ; H01L29/78
摘要:
A problem to be solved is to reduce a leakage current between the gate and the source. Provided is a trench type FET, where a thickness Δ1 of an oxide insulating layer O1 that is closer to the inner side than a line extending upward from the outer peripheral side of a nitride insulating layer N is ½ of a thickness d of the nitride insulating layer N or more; and a thickness Δ2 of an oxide insulating layer O3 between the upper end of the nitride insulating layer N and a gate region is ½ of the thickness d of the nitride insulating layer N or more.
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