- 专利标题： SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
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申请号： US17719721申请日： 2022-04-13
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公开(公告)号： US20230089399A1公开(公告)日： 2023-03-23
- 发明人: Solji SONG , Junyun Kweon , Jumyong Park , Dongjoon Oh , Chungsun Lee , Hyunsu Hwang
- 申请人： SAMSUNG ELECTRONICS CO., LTD.
- 申请人地址： KR Suwon-si
- 专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人地址： KR Suwon-si
- 优先权： KR10-2021-0124638 20210917
- 主分类号： H01L23/528
- IPC分类号： H01L23/528 ; H01L23/532 ; H01L21/78 ; H01L23/498 ; H01L25/00 ; H01L25/065 ; H01L23/00 ; H01L23/16
摘要：
A semiconductor device includes a substrate, an insulating layer on a bottom surface of the substrate, a portion of a top surface of the insulating layer that faces the substrate being exposed outside a side surface of the substrate, a through via penetrating the substrate, an interconnection structure in the insulating layer, and a dummy pattern on the portion of the top surface of the insulating layer that is exposed by the substrate.
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