发明申请
- 专利标题: MAGNETIC SENSOR
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申请号: US17952362申请日: 2022-09-26
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公开(公告)号: US20230094395A1公开(公告)日: 2023-03-30
- 发明人: Ken TANAKA , Kenji KAI , Takuya ISHIDA
- 申请人: Asahi Kasei Microdevices Corporation
- 申请人地址: JP Tokyo
- 专利权人: Asahi Kasei Microdevices Corporation
- 当前专利权人: Asahi Kasei Microdevices Corporation
- 当前专利权人地址: JP Tokyo
- 优先权: JP2021-159555 20210929,JP2022-124140 20220803
- 主分类号: G01R33/07
- IPC分类号: G01R33/07 ; H01L43/04 ; H01L43/06
摘要:
A die pad, a signal processing IC, an adhesive layer, and at least one magnetoelectric conversion element included in a magnetic sensor are encapsulated by a molding resin. At least a part of the first end surface of the signal processing IC is positioned on a side closer to the at least one magnetoelectric conversion element than a first end surface of the die pad on a side of the at least one magnetoelectric conversion element in a plan view. An isolation portion into which the molding resin enters is provided between the first surface of the die pad on a side of the first end surface, and the first surface of the signal processing IC on a side of the first end surface, and a thickness of the isolation portion is smaller than a thickness of the die pad.