Invention Application
- Patent Title: LASER MACHINING DEVICE AND LASER MACHINING METHOD
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Application No.: US17910075Application Date: 2021-03-03
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Publication No.: US20230095941A1Publication Date: 2023-03-30
- Inventor: Iku SANO , Takeshi SAKAMOTO
- Applicant: HAMAMATSU PHOTONICS K.K.
- Applicant Address: JP Hamamatsu-shi, Shizuoka
- Assignee: HAMAMATSU PHOTONICS K.K.
- Current Assignee: HAMAMATSU PHOTONICS K.K.
- Current Assignee Address: JP Hamamatsu-shi, Shizuoka
- Priority: JP2020-040955 20200310
- International Application: PCT/JP2021/008269 WO 20210303
- Main IPC: B23K26/53
- IPC: B23K26/53 ; B23K26/03 ; B23K26/06 ; B23K26/0622

Abstract:
A laser processing device includes an irradiation unit configured to irradiate an object with laser light, an image capturing part configured to capture an image of the object with light having transparency to the object, a display unit configured to display information, and a control unit configured to control at least the irradiation unit, the image capturing part, and the display unit. The control unit performs a first process of irradiating the object with the laser light by control of the irradiation unit to form a modified spot and a fracture extending from the modified spot in the object so as not to reach an outer surface of the object, a second process of, after the first process, capturing an image of the object by control of the image capturing part and acquiring information indicating a formation state of the modified spot and/or the fracture.
Information query
IPC分类: