- 专利标题: Polyamideimide Film-Forming Composition, Polyamideimide Film, Method of Preparing Polyamideimide Film-Forming Composition, Method of Producing Polyamideimide Film, and Uses of Polyamideimide Film-Forming Composition and Polyamideimide Film
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申请号: US17895147申请日: 2022-08-25
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公开(公告)号: US20230096745A1公开(公告)日: 2023-03-30
- 发明人: Cheol Min Yun , So Young Lee , Hye Jin Park , Joo Hyun Lee
- 申请人: SK Innovation Co., Ltd. , SK ie technology Co., Ltd.
- 申请人地址: KR Seoul; KR Seoul
- 专利权人: SK Innovation Co., Ltd.,SK ie technology Co., Ltd.
- 当前专利权人: SK Innovation Co., Ltd.,SK ie technology Co., Ltd.
- 当前专利权人地址: KR Seoul; KR Seoul
- 优先权: KR10-2021-0112858 20210826,KR10-2021-0113041 20210826
- 主分类号: C08L79/08
- IPC分类号: C08L79/08 ; C08J5/18 ; C08G73/14
摘要:
The present disclosure relates to a polyamideimide film-forming composition, a polyamideimide film, a method of preparing a polyamideimide film-forming composition, a method of producing a polyamideimide film, and uses of a polyamideimide film-forming composition and a polyamideimide film. The polyamideimide film according to one embodiment prevents deterioration of colorless and transparent optical properties, has excellent visibility with no optical stains, has excellent heat resistance, is flexible, and has excellent bending properties.
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