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公开(公告)号：US20230096745A1
公开(公告)日：2023-03-30
申请号：US17895147
申请日：2022-08-25
发明人： Cheol Min Yun , So Young Lee , Hye Jin Park , Joo Hyun Lee
摘要： The present disclosure relates to a polyamideimide film-forming composition, a polyamideimide film, a method of preparing a polyamideimide film-forming composition, a method of producing a polyamideimide film, and uses of a polyamideimide film-forming composition and a polyamideimide film. The polyamideimide film according to one embodiment prevents deterioration of colorless and transparent optical properties, has excellent visibility with no optical stains, has excellent heat resistance, is flexible, and has excellent bending properties.
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公开(公告)号：US20220389165A1
公开(公告)日：2022-12-08
申请号：US17735811
申请日：2022-05-03
发明人： Joo Hyun Lee , Sang Yoon Park , So Young Lee
IPC分类号： C08G73/10 , C08J5/18 , C07D241/04 , C07D243/08 , C07D498/18
摘要： Provided a diamine compound, a polyimide precursor and a polyimide film using the same, and a use thereof. The diamine compound may be very useful as a monomer for manufacturing a polyimide film having excellent transparency, high heat resistance, and low retardation.
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公开(公告)号：US11530228B2
公开(公告)日：2022-12-20
申请号：US17371471
申请日：2021-07-09
发明人： So Young Lee , Jong Chan Kim
IPC分类号： C07D495/20 , C07D493/10 , C08J5/18 , C08G73/10
摘要： Provided are a novel tetracarboxylic acid dianhydride and a method for preparing the same. According to an exemplary embodiment of the present invention, a novel tetracarboxylic acid dianhydride appropriate for providing a polyimide film having high transparency and thermal resistance and having excellent thermal dimensional stability due to a substrate of which the stress is not increased even with a heat treatment at a high temperature and a method for preparing the same may be provided.
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公开(公告)号：US20220009943A1
公开(公告)日：2022-01-13
申请号：US17371471
申请日：2021-07-09
发明人： So Young Lee , Jong Chan Kim
IPC分类号： C07D495/20 , C07D493/10 , C08G73/10 , C08J5/18
摘要： Provided are a novel tetracarboxylic acid dianhydride and a method for preparing the same. According to an exemplary embodiment of the present invention, a novel tetracarboxylic acid dianhydride appropriate for providing a polyimide film having high transparency and thermal resistance and having excellent thermal dimensional stability due to a substrate of which the stress is not increased even with a heat treatment at a high temperature and a method for preparing the same may be provided.
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公开(公告)号：US20220010071A1
公开(公告)日：2022-01-13
申请号：US17371428
申请日：2021-07-09
发明人： Jong Chan Kim , So Young Lee
IPC分类号： C08G73/10 , C08J5/18 , C07D493/10 , C07D495/20
摘要： Provided are a polyimide precursor, a polyimide precursor solution, a polyimide film, a method for preparing the same, and a use thereof. According to an exemplary embodiment of the present invention, a polyimide film having excellent thermal resistance and satisfying transparency and a low coefficient of linear thermal expansion may be provided, and thus, may be usefully applied in a flexible display field requiring high dimensional stability and the like.
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公开(公告)号：US20230125363A1
公开(公告)日：2023-04-27
申请号：US17972745
申请日：2022-10-25
发明人： Jong Chan Kim , Jin Hyung Park , Seung Min Jeon , Hyo Shin Kwak , So Young Lee
IPC分类号： C08G73/14
摘要： Provided are a polyamideimide precursor, a polyamideimide prepared therefrom, and a polyamideimide film including the same. Specifically, the polyamideimide film according to an exemplary embodiment includes a polyamideimide derived from a combination of specific compositions to implement a high modulus and excellent optical properties.
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公开(公告)号：US20220348589A1
公开(公告)日：2022-11-03
申请号：US17723794
申请日：2022-04-19
发明人： Cheol Woo Kim , Hyo Shin Kwak , So Young Lee
IPC分类号： C07D487/10 , C08G73/10 , C08J5/18
摘要： The present invention relates to a diazaspiro compound and a use thereof. The diazaspiro compound may be significantly advantageously used as a monomer for producing a polyimide film having excellent optical properties.
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