Invention Application
- Patent Title: THERMOPLASTIC POLYAMIDE MOLDING COMPOSITIONS THAT RESIST HEAT
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Application No.: US17759213Application Date: 2021-01-26
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Publication No.: US20230102597A1Publication Date: 2023-03-30
- Inventor: Anna Maria Mueller-Cristadoro , Michael Roth , Michaela Heussler , Sebastian Wagner
- Applicant: BASF SE
- Applicant Address: DE Ludwigshafen am Rhein
- Assignee: BASF SE
- Current Assignee: BASF SE
- Current Assignee Address: DE Ludwigshafen am Rhein
- Priority: EP20153929.3 20200127
- International Application: PCT/EP2021/051659 WO 20210126
- Main IPC: C08L77/06
- IPC: C08L77/06

Abstract:
Disclosed herein is a thermoplastic molding composition which includes A) from 10 to 99.9% by weight of a thermoplastic polyamide, B) from 0.1 to 20% by weight of at least one hyperbranched polyester having an acid number in the range of from 10 to 700 mg KOH/g and a hydroxyl number in the range of from 0 to 550 mg KOH/g, C) from 0 to 50% by weight of fibrous or particulate fillers, and D) from 0 to 45% by weight of further additives, where the total of the percentages by weight of components A) to D) is 100% by weight.
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