Invention Application
- Patent Title: EXTRACELLULAR MATRIX-BASED BIOADHESIVE
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Application No.: US17936385Application Date: 2022-09-29
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Publication No.: US20230111780A1Publication Date: 2023-04-13
- Inventor: Hyeon Ji KIM , Je Hwan JANG , Won Il HAN , Joon Young KIM , Jin Ah JANG , Dong Woo CHO
- Applicant: POSTECH Research and Business Development Foundation , Konkuk University Industrial Cooperation Corp
- Applicant Address: KR Pohang-si; KR Seoul
- Assignee: POSTECH Research and Business Development Foundation,Konkuk University Industrial Cooperation Corp
- Current Assignee: POSTECH Research and Business Development Foundation,Konkuk University Industrial Cooperation Corp
- Current Assignee Address: KR Pohang-si; KR Seoul
- Priority: KR10-2021-0133757 20211008
- Main IPC: A61L24/00
- IPC: A61L24/00 ; A61L24/10

Abstract:
An embodiment of the present disclosure provides an extracellular matrix-based bioadhesive as an adhesive in the form of a composition including an extracellular matrix-containing hydrogel and a gelatin curing agent, wherein the extracellular matrix-containing hydrogel is gelatinized. Since the extracellular matrix-based bioadhesive according to an embodiment of the present disclosure has the same or similar rheological properties as gelatin, the bioadhesive has flowability at a temperature of 30° C. or higher and may be evenly and easily applied to a lesion site in the body. In addition, the extracellular matrix-based bioadhesive according to an embodiment of the present disclosure may adhere well to the lesion site because of a level of adhesive strength that is about 2 to 6 times higher than that of fibrin glue used as a commercial tissue adhesive. In addition, the extracellular matrix-based bioadhesive according to an embodiment of the present disclosure is based on a tissue-derived extracellular matrix, and thus includes a tissue-derived wound healing component or a tissue regeneration component, and may be used for wound healing or tissue regeneration in addition to bioadhesive applications.
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