A semiconductor package includes a first semiconductor chip, a second semiconductor chip disposed on the first semiconductor chip, a chip connection terminal configured to electrically connect the first semiconductor chip to the second semiconductor chip, an underfill layer disposed between the first semiconductor chip and the second semiconductor chip and surrounding the chip connection terminal, a vertical porous structure filling spaces of a plurality of vertical cooling channels passing through the first semiconductor chip, the second semiconductor chip, and the underfill layer in a vertical direction, and having a plurality of cooling holes, and a cooling fluid provided to the plurality of cooling holes of the vertical porous structure to flow inside the plurality of vertical cooling channels.