- 专利标题: SEMICONDUCTOR LIGHT-EMITTING ELEMENT
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申请号: US18045831申请日: 2022-10-12
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公开(公告)号: US20230114703A1公开(公告)日: 2023-04-13
- 发明人: Jumpei YAMAMOTO , Tetsuya IKUTA
- 申请人: DOWA Electronics Materials Co., Ltd.
- 申请人地址: JP Tokyo
- 专利权人: DOWA Electronics Materials Co., Ltd.
- 当前专利权人: DOWA Electronics Materials Co., Ltd.
- 当前专利权人地址: JP Tokyo
- 优先权: JP2018-080899 20180419,JP2019-079334 20190418
- 主分类号: H01L33/30
- IPC分类号: H01L33/30 ; H01L33/00 ; H01L33/22 ; H01L33/46 ; H01L33/56
摘要:
A semiconductor light-emitting element comprises, in this order, a substrate, a reflective layer, a first conductivity type cladding layer made of InGaAsP containing at least In and P, a semiconductor light-emitting layer having an emission central wavelength of 1000 nm to 2200 nm and a second conductivity type cladding layer made of InGaAsP containing at least In and P, the second conductivity type cladding layer being configured to be on a light extraction side, a surface of a light extraction face of the second conductivity type cladding layer being a roughened surface which has a surface roughness Ra of 0.03 μm or more and has a random irregularity pattern. The surface of the light extraction face has a skewness Rsk of −1 or more, and a protective film is provided on the light extraction face.
公开/授权文献
- US11637220B1 Semiconductor light-emitting element 公开/授权日:2023-04-25
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