- 专利标题: SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME
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申请号: US17845092申请日: 2022-06-21
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公开(公告)号: US20230118405A1公开(公告)日: 2023-04-20
- 发明人: Xiang LIU
- 申请人: CHANGXIN MEMORY TECHNOLOGIES, INC.
- 申请人地址: CN Hefei City
- 专利权人: CHANGXIN MEMORY TECHNOLOGIES, INC.
- 当前专利权人: CHANGXIN MEMORY TECHNOLOGIES, INC.
- 当前专利权人地址: CN Hefei City
- 优先权: CN202111208520.8 20211018
- 主分类号: H01L21/02
- IPC分类号: H01L21/02 ; H01L21/768 ; H01L21/76 ; H01L21/306
摘要:
Embodiments of the disclosure provide a semiconductor structure and a method for forming the same. The semiconductor structure includes: a semiconductor substrate including a plurality of active areas and first isolation structures arranged at intervals along a first direction; gate structures located in the active areas and the first isolation structures. Top surfaces of the active areas extend beyond top surfaces of the gate structures; second isolation structures with a preset height located on surfaces of the gate structures, and the top surfaces of the second isolation structures are flush with the top surfaces of the active areas.
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