Invention Application
- Patent Title: LIQUID CURABLE THERMAL BARRIER COMPOSITIONS FOR ELECTROCHEMICAL CELLS
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Application No.: US17502849Application Date: 2021-10-15
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Publication No.: US20230124482A1Publication Date: 2023-04-20
- Inventor: Bhaskara Rao Boddakayala , Patrick Daniel Maguire , Brian Utley , Thomas Edward Smith , Mohammadreza Eftekhari
- Applicant: FORD GLOBAL TECHNOLOGIES, LLC
- Applicant Address: US MI Dearborn
- Assignee: FORD GLOBAL TECHNOLOGIES, LLC
- Current Assignee: FORD GLOBAL TECHNOLOGIES, LLC
- Current Assignee Address: US MI Dearborn
- Main IPC: H01M10/658
- IPC: H01M10/658 ; H01M10/653
Abstract:
An electrochemical system having a thermal barrier layer is provided. The thermal barrier layer includes a polymer network having an inorganic portion and an organic portion such as silicone or a polysiloxane polymer network. The polymer network may further include filler component dispersed therein such as oxidized polyacrylonitrile milled fiber, Aerogel, hollow glass microspheres, and mica.
Information query
