Invention Application
- Patent Title: FILM AND LAMINATE
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Application No.: US17896015Application Date: 2022-08-25
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Publication No.: US20230125850A1Publication Date: 2023-04-27
- Inventor: Yasuyuki SASADA
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Priority: JP2021-140221 20210830
- Main IPC: C08L23/30
- IPC: C08L23/30 ; C09J123/30 ; C09J7/38 ; C09J7/28

Abstract:
Provided are a film including a matrix material, and a particle having an elastic modulus at 25° C. which is higher than an elastic modulus of the matrix material, in which the film has a region A at at least a part between the matrix material and the particle, and the region A contains a compound having a loss tangent of 0.1 or greater at 25° C.; and a laminate formed of the film.
Information query