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    PRESSURE-SENSITIVE ADHESIVE SHEET, OPTICAL MEMBER, AND TOUCH PANEL
    5.
    发明公开
    PRESSURE-SENSITIVE ADHESIVE SHEET, OPTICAL MEMBER, AND TOUCH PANEL 审中-公开

    公开(公告)号：US20230220247A1

    公开(公告)日：2023-07-13

    申请号：US18009136

    申请日：2021-06-09

    申请人： NITTO DENKO CORPORATION

    发明人： Hirofumi KATAMI ,  Masamichi MATSUMOTO ,  Takahiro NONAKA

    IPC分类号： C09J7/38 ,  C09J11/06 ,  C09J7/28 ,  B32B15/02 ,  G06F3/041 ,  G06F3/044

    CPC分类号： C09J7/385 ,  C09J11/06 ,  C09J7/28 ,  B32B15/02 ,  G06F3/0412 ,  G06F3/044 ,  B32B15/085

    摘要： An object of the present invention is to provide a pressure-sensitive adhesive sheet enables a pressure-sensitive adhesive layer to be formed, wherein the pressure-sensitive adhesive layer has a low dielectric constant, is excellent in level difference conformability while maintaining adhesive strength and adhesion reliability at high temperatures, and suitable for laminating a metal mesh film and the like. The pressure-sensitive adhesive sheet of the present invention is a pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer, the pressure-sensitive adhesive layer containing an acrylic polymer (A) and a hydrogenated polyolefinic resin (B) that exhibits liquid flowability at 25° C. The pressure-sensitive adhesive layer has a dielectric constant at a frequency of 1 MHz of from 2.3 to 3.5. The pressure-sensitive adhesive sheet has a 180° peel adhesive strength to a glass plate at a tensile speed of 300 mm/minute at 65° C. of 6 N/20 mm or more. In the pressure-sensitive adhesive sheet, the proportion of the 180° peel adhesive strength to a glass plate at a tensile speed of 300 mm/minute at 65° C. to the 180° peel adhesive strength to a glass plate at a tensile speed of 300 mm/minute at 25° C. (180° peel adhesive strength to a glass plate at a tensile speed of 300 mm/minute at 65° C./180° peel adhesive strength to a glass plate at a tensile speed of 300 mm/minute at 25° C.×100) is 30 or more.

    ELECTRICALLY CONDUCTIVE BONDING TAPE WITH LOW PASSIVE INTERMODULATION
    8.
    发明申请
    ELECTRICALLY CONDUCTIVE BONDING TAPE WITH LOW PASSIVE INTERMODULATION 有权

    公开(公告)号：US20230110790A1

    公开(公告)日：2023-04-13

    申请号：US17992224

    申请日：2022-11-22

    申请人： 3M INNOVATIVE PROPERTIES COMPANY

    发明人： Jeongwan Choi ,  Jeffrey W. McCutcheon ,  Marina M. Kaplun ,  Steven Y. Yu ,  Jinbae Kim

    IPC分类号： C09J7/38 ,  H01R4/04 ,  H05K9/00 ,  C09J7/28 ,  C09J7/25

    摘要： An electrically conductive bonding tape includes a conductive self-supporting first layer conductive in each of three mutually orthogonal directions and including conductive opposing first and second major surfaces, an conductive second layer coated on the first major surface of the self-supporting first layer and having at least 60% by weight of nickel, the second layer having an exposed major surface facing away from the first major surface of the self-supporting first layer and exposing at least some of the nickel in the second layer, and a conductive adhesive third layer bonded to the second major surface of the self-supporting first layer opposite the second layer. The adhesive third layer is conductive in at least one of the three mutually orthogonal directions and includes a plurality of conductive elements dispersed in an insulative material, at least some of the conductive elements physically contacting the self-supporting first layer.