Invention Application
- Patent Title: COMPOSITE MATERIAL
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Application No.: US17915578Application Date: 2021-03-30
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Publication No.: US20230131295A1Publication Date: 2023-04-27
- Inventor: Tetsuya OTSUKA , Takanobu MIMURA , Tomoya KATO
- Applicant: NITTO DENKO CORPORATION
- Applicant Address: JP Ibaraki-shi, Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Ibaraki-shi, Osaka
- Priority: JP2020-064907 20200331
- International Application: PCT/JP2021/013739 WO 20210330
- Main IPC: C08J9/00
- IPC: C08J9/00 ; C08K3/38 ; C08J9/16

Abstract:
A composite material according to the present invention includes a solid portion including inorganic particles and a resin. The composite material has a porous structure including a plurality of voids surrounded by the solid portion. The composite material has a heat conductivity of 0.5 W/(m·K) or more and a spring constant of 100 N/m to 70,000 N/m. The heat conductivity is a value measured for one test specimen in a symmetric configuration according to an American Society for Testing and Materials (ASTM) standard D5470-01.
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