- 专利标题: LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD USING THE SAME
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申请号: US17879912申请日: 2022-08-03
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公开(公告)号: US20230132812A1公开(公告)日: 2023-05-04
- 发明人: KYUWON SHIM
- 申请人: Samsung Display Co.,Ltd
- 申请人地址: KR Yongin-si
- 专利权人: Samsung Display Co.,Ltd
- 当前专利权人: Samsung Display Co.,Ltd
- 当前专利权人地址: KR Yongin-si
- 优先权: KR10-2021-0147167 20211029
- 主分类号: B23K26/06
- IPC分类号: B23K26/06 ; H01L51/56 ; B23K26/70 ; B23K26/082 ; B23K26/12
摘要:
A laser processing apparatus includes: a laser light source configured to generate a laser beam; a plurality of scanners, wherein each of the plurality of scanners is configured to move the laser beam along a processing path so that the laser beam is irradiated onto a corresponding workpiece of a plurality of workpieces, respectively; a plurality of lenses respectively disposed between the plurality of scanners and the plurality of workpieces; and a measuring circuit spaced apart from the plurality of lenses with the plurality of workpieces interposed therebetween, wherein: the measuring circuit moves along a measuring path and measures a characteristic of the laser beam; and the measuring path overlaps the processing path of each of the plurality of scanners.