A bonding apparatus includes: an anisotropic conductive film (“ACF”) attachment unit which attaches a first ACF and a second ACF onto a display panel assembly; a compression unit which compresses a first chip-on-film (“COF”) on the first ACF and compresses a second COF on the second ACF; and a buffer unit which rotates the display panel assembly, on which the first ACF and the second COF are compressed, on a plane.