Invention Application
- Patent Title: BONDING APPARATUS AND BONDING METHOD
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Application No.: US18147990Application Date: 2022-12-29
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Publication No.: US20230133340A1Publication Date: 2023-05-04
- Inventor: Myong Soo OH , Doo San PARK , Hyun Chul JIN , Hee Jong SHIN
- Applicant: SAMSUNG DISPLAY CO., LTD.
- Applicant Address: KR Yongin-si
- Assignee: SAMSUNG DISPLAY CO., LTD.
- Current Assignee: SAMSUNG DISPLAY CO., LTD.
- Current Assignee Address: KR Yongin-si
- Priority: KR10-2018-0134621 20181105
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H05K1/18

Abstract:
A bonding apparatus includes: an anisotropic conductive film (“ACF”) attachment unit which attaches a first ACF and a second ACF onto a display panel assembly; a compression unit which compresses a first chip-on-film (“COF”) on the first ACF and compresses a second COF on the second ACF; and a buffer unit which rotates the display panel assembly, on which the first ACF and the second COF are compressed, on a plane.
Information query
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