公开(公告)号：US20230133340A1

公开(公告)日：2023-05-04

申请号：US18147990

申请日：2022-12-29

申请人： SAMSUNG DISPLAY CO., LTD.

发明人： Myong Soo OH ,  Doo San PARK ,  Hyun Chul JIN ,  Hee Jong SHIN

IPC分类号： H01L23/00 ,  H05K1/18

摘要： A bonding apparatus includes: an anisotropic conductive film (“ACF”) attachment unit which attaches a first ACF and a second ACF onto a display panel assembly; a compression unit which compresses a first chip-on-film (“COF”) on the first ACF and compresses a second COF on the second ACF; and a buffer unit which rotates the display panel assembly, on which the first ACF and the second COF are compressed, on a plane.