A method for manufacturing a light-emitting device includes preparing light-emitting elements, each including a semiconductor structure body that includes a first surface including recesses, a second surface, and a lateral surface. The method includes disposing the light-emitting elements on an adhesive sheet member so that the second surfaces face the sheet member and the lateral surfaces are covered with the sheet member. The method includes causing a first member to contact the first surfaces so that the first member is located inside the recesses and located between the sheet member and a second member in a state in which the second member is located on the first member. The first member includes a transmissive uncured resin member. The second member includes a wavelength conversion material and has a higher hardness than the uncured resin member. The method includes curing the first member, and removing the sheet member.