Invention Application
- Patent Title: SEMICONDUCTOR DEVICE PACKAGE WITH THERMAL PAD
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Application No.: US17515176Application Date: 2021-10-29
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Publication No.: US20230136784A1Publication Date: 2023-05-04
- Inventor: Anindya Poddar , Ashok Surendra Prabhu , Edgar Dorotyao Balidoy , Hau Nguyen , Makoto Yoshino , MING LI
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L21/48 ; H01L23/00 ; H01L21/56 ; H05K1/02

Abstract:
A described example includes: a package substrate having a die pad with a die side surface and having an opposite backside surface, having leads arranged along two opposite sides and having die pad straps extending from two opposing ends of the die pad. The leads lie in a first plane, a portion of the die pad straps lie in a second plane that is spaced from the first plane and located closer to the die pad, and the die pad lies in a third plane that is spaced from and parallel to the second plane in a direction away from the first plane. A semiconductor die is mounted to the die side surface and mold compound covers the semiconductor die, a portion of the leads, and the die side surface of the die pad, and the backside surface of the die pad exposed from the mold compound.
Public/Granted literature
- US12021019B2 Semiconductor device package with thermal pad Public/Granted day:2024-06-25
Information query
IPC分类: