公开(公告)号：US20230136784A1

公开(公告)日：2023-05-04

申请号：US17515176

申请日：2021-10-29

Applicant: Texas Instruments Incorporated

Inventor： Anindya Poddar ,  Ashok Surendra Prabhu ,  Edgar Dorotyao Balidoy ,  Hau Nguyen ,  Makoto Yoshino ,  MING LI

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/00 ,  H01L21/56 ,  H05K1/02

Abstract: A described example includes: a package substrate having a die pad with a die side surface and having an opposite backside surface, having leads arranged along two opposite sides and having die pad straps extending from two opposing ends of the die pad. The leads lie in a first plane, a portion of the die pad straps lie in a second plane that is spaced from the first plane and located closer to the die pad, and the die pad lies in a third plane that is spaced from and parallel to the second plane in a direction away from the first plane. A semiconductor die is mounted to the die side surface and mold compound covers the semiconductor die, a portion of the leads, and the die side surface of the die pad, and the backside surface of the die pad exposed from the mold compound.

公开(公告)号：US20240347441A1

公开(公告)日：2024-10-17

申请号：US18753858

申请日：2024-06-25

Applicant: Texas Instruments Incorporated

Inventor： Anindya Poddar ,  Ashok Surendra Prabhu ,  Edgar Dorotyao Balidoy ,  Hau Nguyen ,  Makoto Yoshino ,  MING LI

IPC: H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H05K1/02

CPC classification number: H01L23/49861 ,  H01L21/4839 ,  H01L21/565 ,  H01L23/49844 ,  H01L24/48 ,  H05K1/0204 ,  H01L2224/48177 ,  H01L2224/48178 ,  H01L2224/48248 ,  H01L2224/48465 ,  H01L2924/1811 ,  H01L2924/182

Abstract: A described example includes: a package substrate having a die pad with a die side surface and having an opposite backside surface, having leads arranged along two opposite sides and having die pad straps extending from two opposing ends of the die pad. The leads lie in a first plane, a portion of the die pad straps lie in a second plane that is spaced from the first plane and located closer to the die pad, and the die pad lies in a third plane that is spaced from and parallel to the second plane in a direction away from the first plane. A semiconductor die is mounted to the die side surface and mold compound covers the semiconductor die, a portion of the leads, and the die side surface of the die pad, and the backside surface of the die pad exposed from the mold compound.