Invention Application
- Patent Title: IMAGE SENSOR AND METHOD OF FABRICATING THE SAME
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Application No.: US17886578Application Date: 2022-08-12
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Publication No.: US20230136919A1Publication Date: 2023-05-04
- Inventor: DONGCHAN KIM , Hwiyoung JEONG
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR SUWON-SI
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR SUWON-SI
- Priority: KR10-2021-0146058 20211028
- Main IPC: H01L27/146
- IPC: H01L27/146

Abstract:
An image sensor includes: a substrate including an active region and a peripheral region, unit pixels disposed on the active region, device isolation patterns defining the unit pixels disposed on the active region, a light-shield layer on the substrate and having a grid structure defining optical transmission regions, color filters on the light-shield layer, and microlenses on the color filters. The device isolation patterns include first device isolation patterns and a second device isolation pattern, wherein the first device isolation patterns are disposed on a central portion of the active region, and the second device isolation pattern is between the first device isolation patterns and the peripheral region. The first device isolation patterns have a first top surface substantially parallel to a bottom surface of the substrate. The second device isolation pattern has a second top surface, wherein the second top surface approaches the bottom surface of the substrate in a direction toward the peripheral region.
Information query
IPC分类: