Invention Application
- Patent Title: SEMICONDUCTOR PACKAGE
-
Application No.: US17978507Application Date: 2022-11-01
-
Publication No.: US20230138813A1Publication Date: 2023-05-04
- Inventor: Sunkyoung SEO , Chajea JO , Yeongseon KIM , Juhyeon KIM , Hyoeun KIM
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR SUWON-SI
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR SUWON-SI
- Priority: KR10-2021-0148959 20211102,KR10-2022-0016973 20220209
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/48 ; H01L25/065

Abstract:
A first semiconductor chip includes a first semiconductor substrate, a first wiring structure arranged on the first semiconductor substrate, a plurality of through electrodes penetrating through at least a portion of the first semiconductor substrate, and a plurality of first bonding pads respectively connected to the plurality of through electrodes. A second semiconductor chip is stacked on the first semiconductor chip and includes a second semiconductor substrate, a second wiring structure arranged on the second semiconductor substrate, and a second bonding pad connected to each of the plurality of first bonding pads and arranged on the active surface of the second semiconductor substrate. Each first bonding pad has a top surface that is in direct contact with the second bonding pad and a bottom surface that is in direct contact with one through electrode.
Information query
IPC分类: