Invention Application
- Patent Title: TANTALUM CAPACITOR
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Application No.: US17834277Application Date: 2022-06-07
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Publication No.: US20230140133A1Publication Date: 2023-05-04
- Inventor: Yong Hyun Lee , Jin Ho Hong , Hyun Sub Oh , Youn Soo Kim , Jae Bum Cho , Hee Sung Choi
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2021-0145574 20211028
- Main IPC: H01G9/025
- IPC: H01G9/025 ; H01G9/042 ; H01G9/08 ; H01G9/012

Abstract:
A tantalum capacitor includes a sintered tantalum body including tantalum powder, a conductive polymer layer disposed on the sintered tantalum body and including a first filler, a carbon layer disposed on the conductive polymer layer; and a tantalum body including a tantalum wire penetrating through at least a portion of each of the sintered tantalum body and the conductive polymer layer in a first direction. A ratio of an area of the first filler to an area of the conductive polymer layer is greater than 0.38 in a first cross-section partially overlapping the sintered tantalum body, among cross-sections perpendicular to the first direction.
Public/Granted literature
- US12014883B2 Tantalum capacitor including conductive polymer layer having a filler Public/Granted day:2024-06-18
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