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公开(公告)号：US12014883B2
公开(公告)日：2024-06-18
申请号：US17834277
申请日：2022-06-07
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Yong Hyun Lee , Jin Ho Hong , Hyun Sub Oh , Youn Soo Kim , Jae Bum Cho , Hee Sung Choi
Abstract: A tantalum capacitor includes a sintered tantalum body including tantalum powder, a conductive polymer layer disposed on the sintered tantalum body and including a first filler, a carbon layer disposed on the conductive polymer layer; and a tantalum body including a tantalum wire penetrating through at least a portion of each of the sintered tantalum body and the conductive polymer layer in a first direction. A ratio of an area of the first filler to an area of the conductive polymer layer is greater than 0.38 in a first cross-section partially overlapping the sintered tantalum body, among cross-sections perpendicular to the first direction.
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公开(公告)号：US20150114696A1
公开(公告)日：2015-04-30
申请号：US14525062
申请日：2014-10-27
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Jin Ho Hong , Keun Yong Lee , Sung Han Kim , Sa Yong Lee , Sang Hyun Shin
CPC classification number: H05K1/186 , H01G2/02 , H01G2/10 , H01G4/224 , H01G4/30 , H05K1/182 , H05K1/185 , H05K3/0035 , H05K3/0038 , H05K3/007 , H05K3/4602 , H05K3/4605 , H05K2201/0116 , H05K2201/10015 , H05K2201/10636 , H05K2203/0278 , H05K2203/1147 , H05K2203/1469 , Y02P70/611 , Y10T29/49163
Abstract: Disclosed herein are a core substrate and a method for manufacturing the same. According to a preferred embodiment of the present invention, a core substrate includes: a porous scaffold formed with a void; an insulating material formed to fill a void of the porous scaffold; and an electronic device embedded into the porous scaffold and the insulating material and having external electrodes formed on both surfaces thereof.
Abstract translation: 这里公开了核心基板及其制造方法。 根据本发明的优选实施例，芯基板包括：形成有空隙的多孔支架; 形成为填充多孔支架的空隙的绝缘材料; 以及嵌入到多孔支架中的电子装置和绝缘材料，并且在其两个表面上形成有外部电极。
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公开(公告)号：US11942279B2
公开(公告)日：2024-03-26
申请号：US17988298
申请日：2022-11-16
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jin Ho Hong , Young Seuck Yoo , Hee Sung Choi , Young June Lee
CPC classification number: H01G9/025 , H01G9/15 , H01G2009/05 , H01G9/052
Abstract: A tantalum capacitor includes a tantalum body comprising a tantalum sintered body containing tantalum powder, a conductive polymer layer disposed on the tantalum sintered body and including a first filler as a non-conductive particle, and a tantalum wire. The first filler includes a core including at least one metal oxide among BaTiO3, Al2O3, SiO2 and ZrO2, and a coating film disposed on a surface of the core.
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公开(公告)号：US20230140133A1
公开(公告)日：2023-05-04
申请号：US17834277
申请日：2022-06-07
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Yong Hyun Lee , Jin Ho Hong , Hyun Sub Oh , Youn Soo Kim , Jae Bum Cho , Hee Sung Choi
Abstract: A tantalum capacitor includes a sintered tantalum body including tantalum powder, a conductive polymer layer disposed on the sintered tantalum body and including a first filler, a carbon layer disposed on the conductive polymer layer; and a tantalum body including a tantalum wire penetrating through at least a portion of each of the sintered tantalum body and the conductive polymer layer in a first direction. A ratio of an area of the first filler to an area of the conductive polymer layer is greater than 0.38 in a first cross-section partially overlapping the sintered tantalum body, among cross-sections perpendicular to the first direction.
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公开(公告)号：US20180130595A1
公开(公告)日：2018-05-10
申请号：US15642114
申请日：2017-07-05
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jung Woo Choi , Jin Ho Hong , Il Jong Seo , Sa Yong Lee , Myung Sam Kang , Tae Hong Min
CPC classification number: H01F27/2804 , H01F17/0013 , H01F17/0033 , H01F19/04 , H01F27/292 , H01F27/303 , H01F41/041 , H01F2017/004 , H01F2027/2809
Abstract: There are provided an inductor and a method of manufacturing the same. The inductor includes: a body including a coil part; and cover parts disposed on upper and lower surfaces of the body. The coil part includes a plurality of through-vias penetrating through the upper and lower surfaces of the body and connection patterns disposed on the upper and lower surfaces of the body, disposed in the cover parts, and connecting the plurality of through-vias to each other.
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Patent Agency Ranking
公开(公告)号：US20150053469A1
公开(公告)日：2015-02-26
申请号：US14097049
申请日：2013-12-04
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Eun Sil Kim , Sung Han Kim , Sa Yong Lee , Jin Ho Hong , Yong II Kwon , Sang Hyun Shin , Keun Yong Lee
CPC classification number: H05K1/0306 , G03F7/40 , H05K1/0274 , H05K1/0393 , H05K3/107 , H05K3/1258 , H05K3/4061 , H05K3/426 , H05K2201/0376
Abstract: Disclosed herein are a printed circuit board and a method of manufacturing the same.The printed circuit board includes a light-blocking glass substrate; a negative photosensitive insulating layer formed on the glass substrate; and a circuit pattern formed on the glass substrate and embedded in the negative photosensitive insulating layer.
Abstract translation: 这里公开了一种印刷电路板及其制造方法。 印刷电路板包括遮光玻璃基板; 形成在所述玻璃基板上的负光敏绝缘层; 以及形成在玻璃基板上并嵌入在负光敏绝缘层中的电路图案。
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公开(公告)号：US11521801B2
公开(公告)日：2022-12-06
申请号：US16877913
申请日：2020-05-19
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jin Ho Hong , Youn Soo Kim , Oh Choon Kwon , Hyun Sub Oh
Abstract: A solid electrolyte capacitor includes a sintered body formed by sintering a molded body containing metal powder; and a conductive polymer layer disposed above the sintered body. A ratio (t2/t1) of a thickness (t2) of the conductive polymer layer in an edge portion of the sintered body to a thickness (t1) of the conductive polymer layer in a central portion of the sintered body satisfies 0.35≤t2/t1≤0.9.
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公开(公告)号：US11495392B2
公开(公告)日：2022-11-08
申请号：US16567532
申请日：2019-09-11
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Ye Eun Jeong , Jin Ho Hong
Abstract: A coil electronic component includes a body including a laminate structure including a plurality of coil layers, and external electrodes disposed externally on the body. Each of the plurality of coil layers includes an insulating layer, a base pattern, and a coil pattern disposed on the base pattern, and a conductive via connecting the coil pattern to an adjacent coil layer, and the base pattern includes an intermetallic compound of Cu and Sn, and the coil pattern includes a Cu component.
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公开(公告)号：US20220093327A1
公开(公告)日：2022-03-24
申请号：US17188084
申请日：2021-03-01
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jin Ho Hong , Hyun Sub Oh , Youn Soo Kim , Hong Kyu Shin , Hee Sung Choi
Abstract: A tantalum capacitor includes: first and second surfaces facing in a first direction, third and fourth surfaces facing in a second direction, and fifth and sixth surfaces facing in a third direction; a tantalum body having one surface through which a tantalum wire is exposed in the first direction; and a substrate on which the tantalum body is mounted, wherein the substrate may be an organic-inorganic composite substrate.
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公开(公告)号：US20210166886A1
公开(公告)日：2021-06-03
申请号：US16877913
申请日：2020-05-19
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jin Ho Hong , Youn Soo Kim , Oh Choon Kwon , Hyun Sub Oh
Abstract: A solid electrolyte capacitor includes a sintered body formed by sintering a molded body containing metal powder; and a conductive polymer layer disposed above the sintered body. A ratio (t2/t1) of a thickness (t2) of the conductive polymer layer in an edge portion of the sintered body to a thickness (t1) of the conductive polymer layer in a central portion of the sintered body satisfies 0.35≤t2/t1≤0.9.
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