Invention Publication
- Patent Title: ANTENNA MODULE GROUNDING FOR PHASED ARRAY ANTENNAS
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Application No.: US18369691Application Date: 2023-09-18
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Publication No.: US20240006763A1Publication Date: 2024-01-04
- Inventor: Gordon Coutts
- Applicant: Amazon Technologies, Inc.
- Applicant Address: US WA Seattle
- Assignee: Amazon Technologies, Inc.
- Current Assignee: Amazon Technologies, Inc.
- Current Assignee Address: US WA Seattle
- Main IPC: H01Q5/42
- IPC: H01Q5/42 ; H01Q5/385 ; H01Q5/392 ; H01Q21/06 ; H01Q19/02 ; H01Q9/04 ; H01Q5/378

Abstract:
Technologies directed to overlaid shared aperture array with improved total efficiency are described. One RF structure includes a first antenna with a first set of antenna elements disposed on a first plane of a support structure and a second antenna with a second set of antenna elements disposed on a second plane of the support structure. A set of parasitic antenna elements are disposed on the first plane. Two adjacent antenna elements, including one from the first plurality of antenna elements and another one from the plurality of parasitic antenna elements, are separated by the second distance.
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