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公开(公告)号：US11705627B1
公开(公告)日：2023-07-18
申请号：US17187443
申请日：2021-02-26
Applicant: Amazon Technologies, Inc.
Inventor： Gordon Coutts
Abstract: Technologies directed to a radio frequency (RF) structure that provides an electrically insulating gap between a ground plane of a circuit board and a chassis at direct current (DC) and an electrical connection between the ground plane and the chassis at RF frequencies. One RF structure includes a first conductor electrically coupled to the ground plane and a second conductor electrically coupled to the chassis. A physical arrangement of a portion of the first conductor and a portion of the second conductor causes the RF structure to provide an electrically insulating gap between the ground plane and the chassis at DC and an electrical connection between the ground plane and the chassis at RF frequencies.
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公开(公告)号：US11211702B1
公开(公告)日：2021-12-28
申请号：US16711393
申请日：2019-12-11
Applicant: Amazon Technologies, Inc.
Inventor： Alireza Mahanfar , Gordon Coutts
Abstract: A communication system can include a support structure, a receiving phased array antenna, and a transmitting phased array antenna that is physically superimposed with the receiving phased array antenna on the support structure. The receiving phased array antenna can include a plurality of receiving antennas and/or transmitting/receiving antennas, and the transmitting phased array antenna can include a plurality of transmitting/receiving antennas and/or transmitting antennas, with at least a subset of transmitting/receiving antennas shared between the two phased array antennas. Appropriate spacing between the antennas of the receiving and transmitting phased array antennas can be achieved by overlaying the transmitting phased array antenna with a rotational offset compared to the receiving phased array antenna, and the different spacing of the antennas in the receiving phased array antenna and the transmitting phased array antenna permits the use of each array in different frequency bands.
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公开(公告)号：US11088453B1
公开(公告)日：2021-08-10
申请号：US16845689
申请日：2020-04-10
Applicant: Amazon Technologies, Inc.
Inventor： Gordon Coutts
Abstract: Technologies directed to vertical coupling structures for antenna feeds of phased array antennas are described. One circuit board includes a first layer with a first portion of a RF coupling structure, a second layer with a second portion of the RF coupling structure, and a first insulation layer located between the first layer and the second layer. The RF coupling structure is configured to electromagnetically couple a first conductive trace on the first layer and a second conductive trace on the second layer at RF frequencies. The circuit board also includes a third layer with a first antenna element and a second insulation layer located between the third layer and the first layer, the second insulation layer including a first via through which the first antenna element is coupled to the first conductive trace.
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Patent Agency Ranking
公开(公告)号：US11545752B1
公开(公告)日：2023-01-03
申请号：US17369782
申请日：2021-07-07
Applicant: Amazon Technologies, Inc.
Inventor： Gordon Coutts
Abstract: Technologies directed to coupling structures for antenna feeds of phased array antennas are described. One circuit board includes a first layer with a first portion of a RF coupling structure, a second layer with a second portion of the RF coupling structure, and a first insulation layer located between the first layer and the second layer. The RF coupling structure is configured to electromagnetically couple a first conductive trace on the first layer and a second conductive trace on the second layer at RF frequencies. The circuit board also includes an RF shielding structure coupled to a ground connection on the second layer and located in the first insulation layer. The RF shielding structure is configured to operate as a RF short circuit between the ground connection and a third conductive trace on the first layer at RF frequencies.
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公开(公告)号：US11843187B2
公开(公告)日：2023-12-12
申请号：US17240205
申请日：2021-04-26
Applicant: Amazon Technologies, Inc.
Inventor： Gordon Coutts
CPC classification number: H01Q5/42 , H01Q5/378 , H01Q5/385 , H01Q5/392 , H01Q9/0414 , H01Q19/021 , H01Q21/065
Abstract: Technologies directed to overlaid shared aperture array with improved total efficiency are described. One RF structure includes a first antenna with a first set of antenna elements disposed on a first plane of a support structure and a second antenna with a second set of antenna elements disposed on a second plane of the support structure. A set of parasitic antenna elements are disposed on the first plane. Two adjacent antenna elements, including one from the first plurality of antenna elements and another one from the plurality of parasitic antenna elements, are separated by the second distance.
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公开(公告)号：US20240006763A1
公开(公告)日：2024-01-04
申请号：US18369691
申请日：2023-09-18
Applicant: Amazon Technologies, Inc.
Inventor： Gordon Coutts
CPC classification number: H01Q5/42 , H01Q5/385 , H01Q5/392 , H01Q21/065 , H01Q19/021 , H01Q9/0414 , H01Q5/378
Abstract: Technologies directed to overlaid shared aperture array with improved total efficiency are described. One RF structure includes a first antenna with a first set of antenna elements disposed on a first plane of a support structure and a second antenna with a second set of antenna elements disposed on a second plane of the support structure. A set of parasitic antenna elements are disposed on the first plane. Two adjacent antenna elements, including one from the first plurality of antenna elements and another one from the plurality of parasitic antenna elements, are separated by the second distance.
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公开(公告)号：US11532884B1
公开(公告)日：2022-12-20
申请号：US16819982
申请日：2020-03-16
Applicant: Amazon Technologies, Inc.
Inventor： Gordon Coutts , Alireza Mahanfar
Abstract: Technologies directed to interleaved phased array antennas are described. One apparatus includes a support structure, a fist antenna array, and a second antenna array. The first antenna array includes a first set of antenna elements disposed on a surface of the support structure. The first set of antenna elements is spaced apart by a first distance. The second antenna array includes a second set of antenna elements disposed on the surface of the support structure. The second set of antenna elements is located in spaces between the first set of antenna elements on the surface and the second set of antenna elements is spaced apart by a second distance that is less than the first distance.
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公开(公告)号：US20220344816A1
公开(公告)日：2022-10-27
申请号：US17240205
申请日：2021-04-26
Applicant: Amazon Technologies, Inc.
Inventor： Gordon Coutts
Abstract: Technologies directed to overlaid shared aperture array with improved total efficiency are described. One RF structure includes a first antenna with a first set of antenna elements disposed on a first plane of a support structure and a second antenna with a second set of antenna elements disposed on a second plane of the support structure. A set of parasitic antenna elements are disposed on the first plane. Two adjacent antenna elements, including one from the first plurality of antenna elements and another one from the plurality of parasitic antenna elements, are separated by the second distance.
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