- 专利标题: LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME
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申请号: US18252580申请日: 2021-10-29
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公开(公告)号: US20240006840A1公开(公告)日: 2024-01-04
- 发明人: Hideaki MOGI , Masashi NAKAMURA , Jun IWASHITA , Hiroshi KATO
- 申请人: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- 申请人地址: JP Kanagawa
- 专利权人: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- 当前专利权人: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- 当前专利权人地址: JP Kanagawa
- 优先权: JP 20193598 2020.11.20
- 国际申请: PCT/JP2021/039962 2021.10.29
- 进入国家日期: 2023-05-11
- 主分类号: H01S5/02253
- IPC分类号: H01S5/02253 ; H01S5/02 ; H01S5/183
摘要:
Provided are a light emitting device capable of providing lenses or light emitting elements on a substrate in a suitable manner, and a method for manufacturing the light emitting device. A light emitting device of the present disclosure includes: a first substrate; a light emitting element provided on a lower surface of the first substrate; a lens provided on an upper surface of the first substrate; a first protrusion provided on the upper surface of the first substrate; and a first film provided on the upper surface of the first substrate, the first film including a first portion disposed on the lens or forming the lens, and a second portion disposed on the first protrusion or forming the first protrusion, in which a height of an uppermost portion of the first portion is equal to or less than a height of an uppermost portion of the second portion.
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