- 专利标题: HEAT RADIATING STRUCTURE AND ELECTRONIC APPARATUS
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申请号: US18332816申请日: 2023-06-12
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公开(公告)号: US20240014098A1公开(公告)日: 2024-01-11
- 发明人: Ryota Watanabe , Junki Hashiba , Masahiro Kitamura , Takuroh Kamimura
- 申请人: LENOVO (SINGAPORE) PTE. LTD.
- 申请人地址: SG SINGAPORE
- 专利权人: LENOVO (SINGAPORE) PTE. LTD.
- 当前专利权人: LENOVO (SINGAPORE) PTE. LTD.
- 当前专利权人地址: SG SINGAPORE
- 优先权: JP 22108640 2022.07.05
- 主分类号: H01L23/373
- IPC分类号: H01L23/373 ; G06F1/20
摘要:
A heat radiating structure includes a mesh which abuts on a surface of a die of a GPU and a copper plate which is equipped with a recessed part into which the mesh fits and which sandwiches and holds the mesh together with the surface of the die. The mesh includes a heat generating element abutment range part into which a liquid metal is impregnated and which abuts on the surface of the die and receives heat from the die and a heat generating element non-abutment region part which is contiguous to the heat generating element abutment range part and does not abut on the surface of the die. The heat generating element non-abutment range part is fixed to the copper plate with the use of a sponge tape. The heat generating element abutment range part is shaped to protrude from the heat generating element abutment range part.
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