Invention Publication
- Patent Title: VACUUM DEPOSITION INTO TRENCHES AND VIAS
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Application No.: US18346967Application Date: 2023-07-05
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Publication No.: US20240021421A1Publication Date: 2024-01-18
- Inventor: George Xinsheng Guo
- Applicant: Ascentool, Inc.
- Applicant Address: US CA Palo Alto
- Assignee: Ascentool, Inc.
- Current Assignee: Ascentool, Inc.
- Current Assignee Address: US CA Palo Alto
- Main IPC: H01J37/34
- IPC: H01J37/34 ; H01J37/32

Abstract:
A plasma deposition apparatus includes a first plasma source that can produce a plasma confined in a magnetic field. The first plasma source includes a closed-loop electrode defining a center region therein and a central axis through the central region, and one or more magnets that are outside an inner surface of the closed-loop electrode. The magnets can produce a magnetic field in the center region. The one or more magnets can be at least partially embedded in the closed-loop electrode. The closed-loop electrode and the magnets can produce a plasma of ions to sputter atoms off a sputtering target or a backing plate.
Public/Granted literature
- US12154770B2 Vacuum deposition into trenches and vias Public/Granted day:2024-11-26
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