- 专利标题: MOUNTING STRUCTURE OF THERMAL MANAGEMENT MODULE FOR VEHICLE
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申请号: US18376824申请日: 2023-10-04
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公开(公告)号: US20240025228A1公开(公告)日: 2024-01-25
- 发明人: Yeonho KIM , Jeawan KIM , Jae Yeon KIM , Jung Bum CHOI , Seong Woo JEONG , In guk HWANG
- 申请人: HYUNDAI MOTOR COMPANY , Kia Corporation , HANON SYSTEMS
- 申请人地址: KR Seoul
- 专利权人: HYUNDAI MOTOR COMPANY,Kia Corporation,HANON SYSTEMS
- 当前专利权人: HYUNDAI MOTOR COMPANY,Kia Corporation,HANON SYSTEMS
- 当前专利权人地址: KR Seoul; KR Seoul; KR Daejeon
- 优先权: KR 20210080011 2021.06.21
- 主分类号: B60H1/00
- IPC分类号: B60H1/00
摘要:
A mounting structure of a thermal management module for a vehicle according to an embodiment of the present disclosure includes: front side members extending along a length direction of a vehicle and disposed on left and right sides of the vehicle, respectively, in a width direction of the vehicle; a dash reinforcement crossmember extending along the width direction of the vehicle and coupled to rear ends of the front side members on the left and right sides based on a front and rear direction of the vehicle; a crossmember dividing a space formed by the front side members into two spaces in the front and rear direction of the vehicle; and at least one mounting bracket, on which the thermal management module is mounted, configured to mount the thermal management module in one of the two spaces divided by the crossmember.
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