发明公开
- 专利标题: MAGNETIC COMPONENT
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申请号: US18223034申请日: 2023-07-18
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公开(公告)号: US20240029936A1公开(公告)日: 2024-01-25
- 发明人: Hsin-Jung Cheng , Po-Hsiu Chien , Yung-Shou Hsu , Hun-Neng Chen , Hsieh-Shen Hsieh
- 申请人: CYNTEC CO., LTD.
- 申请人地址: TW Hsinchu
- 专利权人: CYNTEC CO., LTD.
- 当前专利权人: CYNTEC CO., LTD.
- 当前专利权人地址: TW Hsinchu
- 主分类号: H01F27/08
- IPC分类号: H01F27/08 ; H01F27/24 ; H01F27/30
摘要:
A magnetic component includes a core, at least one coil and a thermal conductive filler. The core includes an inner leg, at least two outer legs and at least one non-bonding region. The at least one coil is wound around the inner leg or the at least two outer legs. The thermal conductive filler covers a part of the core. At least one part of the at least one non-bonding region is not covered by the thermal conductive filler.
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