公开(公告)号：US20240029936A1

公开(公告)日：2024-01-25

申请号：US18223034

申请日：2023-07-18

申请人： CYNTEC CO., LTD.

发明人： Hsin-Jung Cheng ,  Po-Hsiu Chien ,  Yung-Shou Hsu ,  Hun-Neng Chen ,  Hsieh-Shen Hsieh

IPC分类号： H01F27/08 ,  H01F27/24 ,  H01F27/30

CPC分类号： H01F27/08 ,  H01F27/24 ,  H01F27/306

摘要： A magnetic component includes a core, at least one coil and a thermal conductive filler. The core includes an inner leg, at least two outer legs and at least one non-bonding region. The at least one coil is wound around the inner leg or the at least two outer legs. The thermal conductive filler covers a part of the core. At least one part of the at least one non-bonding region is not covered by the thermal conductive filler.