公开(公告)号：US20240029936A1

公开(公告)日：2024-01-25

申请号：US18223034

申请日：2023-07-18

Applicant: CYNTEC CO., LTD.

Inventor： Hsin-Jung Cheng ,  Po-Hsiu Chien ,  Yung-Shou Hsu ,  Hun-Neng Chen ,  Hsieh-Shen Hsieh

IPC: H01F27/08 ,  H01F27/24 ,  H01F27/30

CPC classification number: H01F27/08 ,  H01F27/24 ,  H01F27/306

Abstract: A magnetic component includes a core, at least one coil and a thermal conductive filler. The core includes an inner leg, at least two outer legs and at least one non-bonding region. The at least one coil is wound around the inner leg or the at least two outer legs. The thermal conductive filler covers a part of the core. At least one part of the at least one non-bonding region is not covered by the thermal conductive filler.

公开(公告)号：US20250029765A1

公开(公告)日：2025-01-23

申请号：US18223033

申请日：2023-07-18

Applicant: CYNTEC CO., LTD.

Inventor： Hsin-Jung Cheng ,  Po-Hsiu Chien ,  Yung-Shou Hsu ,  Hun-Neng Chen ,  Hsieh-Shen Hsieh

IPC: H01F27/22 ,  H01F5/06

Abstract: A magnetic component includes a core, at least one spacer and at least two coils. The core includes an inner leg and at least two outer legs. The at least two coils and the at least one spacer are stacked with each other and directly sleeved on the inner leg. Each of the at least two coils is formed by winding a wire covered by at least three misaligned layers of insulating tape.