A semiconductor device includes a semiconductor element, a first lead, a second lead, and a first wire. The bonding-pad reverse surface is offset from the die-pad reverse surface toward the die-pad obverse surface-side in the z direction. The first wire is bonded to the first electrode and the bonding-pad obverse surface. The bonding pad portion includes a single first portion. The first portion is connected to the bonding-pad reverse surface, is surrounded by the bonding-pad reverse surface as viewed in the z direction, and includes a part present at a position different from the bonding-pad reverse surface in the z direction.