公开(公告)号：US20220301967A1

公开(公告)日：2022-09-22

申请号：US17682980

申请日：2022-02-28

Applicant: ROHM CO., LTD.

Inventor： Ryuta KIMURA ,  Yosui FUTAMURA

IPC: H01L23/31 ,  H01L23/495 ,  H01L23/00

Abstract: A semiconductor device includes: a first lead; a first semiconductor element mounted on the first lead; a sealing resin that covers the first semiconductor element; and a heat transfer member arranged on the first lead, wherein the first lead includes: a first die pad having a first main surface and a first back surface; a second die pad arranged side by side with the first die pad and located on a side of the first main surface with respect to the first die pad; and a connecting portion connected to the first and second die pads, wherein the second die pad has a second main surface facing the same side as the first main surface, and a second back surface facing the same side as the first back surface, and wherein the heat transfer member is arranged on the second back surface and is exposed from the sealing resin.

公开(公告)号：US20240030178A1

公开(公告)日：2024-01-25

申请号：US18478122

申请日：2023-09-29

Applicant: ROHM CO., LTD.

Inventor： Yosui FUTAMURA ,  Shunya MIKAMI

IPC: H01L23/00 ,  H01L23/495

CPC classification number: H01L24/48 ,  H01L24/85 ,  H01L23/4952 ,  H01L23/49503 ,  H01L23/49562 ,  H01L2224/48465 ,  H01L2224/85051 ,  H01L2924/13091 ,  H01L2224/85181

Abstract: A semiconductor device includes a semiconductor element, a first lead, a second lead, and a first wire. The bonding-pad reverse surface is offset from the die-pad reverse surface toward the die-pad obverse surface-side in the z direction. The first wire is bonded to the first electrode and the bonding-pad obverse surface. The bonding pad portion includes a single first portion. The first portion is connected to the bonding-pad reverse surface, is surrounded by the bonding-pad reverse surface as viewed in the z direction, and includes a part present at a position different from the bonding-pad reverse surface in the z direction.

公开(公告)号：US20220301965A1

公开(公告)日：2022-09-22

申请号：US17678278

申请日：2022-02-23

Applicant: ROHM CO., LTD.

Inventor： Ryuta KIMURA ,  Yosui FUTAMURA

IPC: H01L23/31 ,  H01L23/495 ,  H01L23/00

Abstract: There is provided a semiconductor device including: a first lead; a first semiconductor element mounted on the first lead; and a sealing resin that covers the first semiconductor element, wherein the first lead includes a first die pad, a second die pad, a third die pad, a first connecting portion, and a second connecting portion, wherein the first die pad has a first main surface and a first back surface facing opposite sides in a thickness direction, and wherein the second die pad is arranged side by side with the first die pad in a first direction orthogonal to the thickness direction, and is located on a side of the first main surface with respect to the first die pad in the thickness direction.

公开(公告)号：US20170301612A1

公开(公告)日：2017-10-19

申请号：US15479914

申请日：2017-04-05

Applicant: ROHM CO., LTD.

Inventor： Motoharu HAGA ,  Yosui FUTAMURA

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00 ,  H01L21/48

CPC classification number: H01L23/49548 ,  H01L21/4825 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49503 ,  H01L23/49513 ,  H01L23/4952 ,  H01L23/49541 ,  H01L23/49575 ,  H01L23/49582 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/05554 ,  H01L2224/27462 ,  H01L2224/27472 ,  H01L2224/29101 ,  H01L2224/29116 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2224/83026 ,  H01L2224/83439 ,  H01L2224/85439 ,  H01L2224/92247 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/01204 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/013 ,  H01L2924/01047 ,  H01L2924/0105

Abstract: A semiconductor device includes a plurality of islands, each having an outer surface including an upper surface and end surfaces, semiconductor chips, above the respective islands, a bonding material, between the islands and the semiconductor chips, and plating layers, formed on the outer surfaces of the islands, and with at least one of the plurality of islands, the island is exposed as a bare surface region at a first end surface, which, among the end surfaces of the one island, faces the island adjacent thereto.

公开(公告)号：US20240030298A1

公开(公告)日：2024-01-25

申请号：US18480273

申请日：2023-10-03

Applicant: ROHM CO., LTD.

Inventor： Yosui FUTAMURA ,  Shunya MIKAMI

IPC: H01L29/417 ,  H01L23/31 ,  H01L23/495 ,  H01L23/00

CPC classification number: H01L29/41766 ,  H01L23/3121 ,  H01L23/49513 ,  H01L24/48 ,  H01L24/49 ,  H01L24/45 ,  H01L23/49555 ,  H01L24/32 ,  H01L2224/48237 ,  H01L2224/45147 ,  H01L2224/73265 ,  H01L2224/32245 ,  H01L2224/48455 ,  H01L2224/49173

Abstract: A semiconductor device includes: a semiconductor element that includes an element body containing a semiconductor, and a first electrode disposed on the element body; a first wire joined to the first electrode; a sealing resin that covers the semiconductor element and the first wire; and a covering portion interposed between the first electrode and the sealing resin. The first wire includes a first portion that extends from an inside of the first electrode toward an outside of the first electrode as viewed in a thickness direction of the semiconductor. The covering portion contains a material having a higher thermal conductivity than the sealing resin. The covering portion is in contact with the first portion of the first wire.

公开(公告)号：US20230402348A1

公开(公告)日：2023-12-14

申请号：US18253501

申请日：2021-12-20

Applicant: ROHM CO., LTD.

Inventor： Yosui FUTAMURA

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L23/49513 ,  H01L23/3107 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49562 ,  H01L23/49582 ,  H01L21/4825 ,  H01L21/4842 ,  H01L21/565

Abstract: A semiconductor device includes: a support member having an obverse surface facing in a thickness direction; a semiconductor element mounted on the obverse surface; and a bonding layer that bonds the obverse surface and the semiconductor element. The support member has a base member, and a metal layer mounted on the base member and including the obverse surface. The support member includes a first region in contact with the bonding layer, and a second region adjacent to the first region as viewed in the thickness direction. The bonding layer contains a metal composition in a solid phase. The second region is more repellent to a liquid phase of the metal composition than the first region.

公开(公告)号：US20230094354A1

公开(公告)日：2023-03-30

申请号：US17792931

申请日：2021-01-18

Applicant: ROHM CO., LTD.

Inventor： Yosui FUTAMURA ,  Masahiko NAKAMURA

IPC: H01L23/495 ,  H01L23/00

Abstract: An electronic device which can suppress peeling off and damaging of the bonding material is provided. The electronic device includes an electronic component, a mounting portion, and a bonding material. The electronic component has an element front surface and an element back surface separated in the z-direction. The mounting portion has a mounting surface opposed to the element back surface on which the electronic component is mounted. The bonding material bonds the electronic component to the mounting portion. The bonding material includes a base portion and a fillet portion. The base portion is held between the electronic component and the mounting portion in the z-direction. The fillet portion is connected to the base portion and is formed outside the electronic component when seen in the z-direction. The electronic component includes two element lateral surface and ridges. The ridges are intersections of the two element lateral surface and extend in the z-direction. The fillet portion includes a ridge cover portion which covers at least a part of the ridges.

公开(公告)号：US20220301993A1

公开(公告)日：2022-09-22

申请号：US17682965

申请日：2022-02-28

Applicant: ROHM CO., LTD.

Inventor： Ryuta KIMURA ,  Yosui FUTAMURA

IPC: H01L23/495 ,  H01L23/00 ,  H01L25/07

Abstract: A semiconductor device includes: a first lead; a first semiconductor element mounted on the first lead; and a sealing resin that covers the first semiconductor element, wherein the first lead includes: a first die pad having a first main surface and a first back surface facing opposite sides to each other in a thickness direction; a second die pad arranged side by side with the first die pad in a first direction orthogonal to the thickness direction, and located on a side of the first main surface with respect to the first die pad in the thickness direction; and a connecting portion connected to the first die pad and the second die pad, and wherein the first back surface is exposed from the sealing resin.

公开(公告)号：US20240071877A1

公开(公告)日：2024-02-29

申请号：US18502759

申请日：2023-11-06

Applicant: ROHM CO., LTD.

Inventor： Yosui FUTAMURA ,  Shunya MIKAMI ,  Ryuta KIMURA ,  Kazuhisa KUMAGAI

IPC: H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L23/49568 ,  H01L21/4825 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/4952 ,  H01L23/49562 ,  H01L23/49575

Abstract: A semiconductor device includes a first semiconductor element, a first object, a sealing resin and a covering part. The first semiconductor element includes a first electrode. The first object includes a first surface facing the first electrode. The sealing resin covers the first semiconductor element and the first object. The covering part is interposed between the first electrode and the first surface and contains a material having a higher thermal conductivity than the sealing resin.

公开(公告)号：US20240030106A1

公开(公告)日：2024-01-25

申请号：US18480978

申请日：2023-10-04

Applicant: ROHM CO., LTD.

Inventor： Yosui FUTAMURA ,  Shunya MIKAMI

IPC: H01L23/495 ,  H01L23/00

CPC classification number: H01L23/49513 ,  H01L24/05 ,  H01L24/08 ,  H01L24/09 ,  H01L24/45 ,  H01L24/48 ,  H01L24/32 ,  H01L2224/05073 ,  H01L2224/05573 ,  H01L2224/05578 ,  H01L2224/05686 ,  H01L2224/08059 ,  H01L2224/09055 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48245 ,  H01L2924/182 ,  H01L2924/186

Abstract: A semiconductor device includes a semiconductor element, a sealing resin and a covering portion. The semiconductor element includes an element body containing a semiconductor, and a first electrode disposed on the element body. The sealing resin covers the semiconductor element. The covering portion is interposed between the first electrode and the sealing resin. The covering portion contains a material having a higher thermal conductivity than the sealing resin. The first electrode of the semiconductor element includes a groove portion held in contact with the covering portion.