An autonomous immersive cooling container configured to cool at least one electronic device is described. The autonomous immersive cooling container includes a container, having sidewalls, that contains a dielectric immersion cooling liquid, the at least one electronic device being, at least in part, immersed in the dielectric immersion cooling liquid. The autonomous immersive cooling container further includes a plurality of cooling structures disposed at non-perpendicular angles on the sidewalls, the plurality of cooling structures configured to transfer heat from an interior of the container to exterior air such that no additional cooling subsystem is used to cool the dielectric immersion cooling liquid.