HYBRID IMMERSION COOLING SYSTEM FOR RACK-MOUNTED ELECTRONIC ASSEMBLIES

    公开(公告)号:US20220322575A1

    公开(公告)日:2022-10-06

    申请号:US17701422

    申请日:2022-03-22

    申请人: OVH

    IPC分类号: H05K7/20

    摘要: The disclosed systems and structures are directed to providing a hybrid liquid-cooling system for at least one rack-mounted immersion case containing at least one electronic assembly submerged in dielectric immersion cooling liquid. The hybrid liquid cooling system comprises a closed-loop fluid distribution arrangement configured to circulate channelized fluid, an external cooling module configured to thermally condition the channelized fluid circulated by the closed-loop fluid distribution arrangement, a serpentine convection coil structured to internally convey channelized fluid to operatively cool ambient temperatures of the dielectric immersion cooling liquid, and one or more fluid cooling blocks arranged to be in direct thermal contact with one or more heat-generating electronic processing components of the at least one electronic assembly.

    COOLING ARRANGEMENT IMPLEMENTING A PHOTOVOLTAIC DEVICE

    公开(公告)号:US20240305236A1

    公开(公告)日:2024-09-12

    申请号:US18588685

    申请日:2024-02-27

    申请人: OVH

    IPC分类号: H02S10/30 H05K7/20

    摘要: A cooling system and a method for cooling an electronic device are disclosed. The electronic device includes a heat-generating component. The cooling arrangement includes an immersion casing that contains a dielectric cooling liquid, the electronic device being, at least in part, immersed in the dielectric cooling liquid such that the dielectric cooling liquid collects, in use, at least a first portion of a thermal energy generated by the heat-generating component, and a photovoltaic device proximate to the immersion casing and configured to convert at least in part a second portion of the thermal energy generated by the heat-generating component into electric energy, the second portion having radiated from the dielectric cooling liquid and through the immersion casing.

    HERMETIC SEALED ELECTRONIC ASSEMBLY FOR NON DIELECTRIC IMMERSION COOLING SYSTEM

    公开(公告)号:US20240074108A1

    公开(公告)日:2024-02-29

    申请号:US18236509

    申请日:2023-08-22

    申请人: OVH

    IPC分类号: H05K7/20

    摘要: The disclosed systems, structures, and methods are directed to providing a rack-mounted fluid immersion cooling (IC) configuration. The rack-mounted fluid IC configuration comprises a rack-mounted immersion reservoir containing a volume of thermally cooled non-dielectric fluid and at least one electronic processing assembly comprising one or more electronic processing components. The at least one electronic processing assembly being encased within a hermetic sealed bag configured to provide a water- and air-tight seal of the at least one electronic processing assembly to shield against the direct exposure of the electronic processing components to fluids. The at least one hermetic sealed electronic processing assembly is submerged within the volume of thermally cooled fluid contained by the rack-mounted immersion reservoir.

    SERIALIZED LIQUID COOLING ARRANGEMENTS FOR DATACENTER SERVER RACKS

    公开(公告)号:US20240334648A1

    公开(公告)日:2024-10-03

    申请号:US18617792

    申请日:2024-03-27

    申请人: OVH

    IPC分类号: H05K7/20

    摘要: A liquid cooling arrangement for cooling heat-generating components of a datacenter server rack. The cooling arrangement includes a liquid cooling loop configured to convey a cooling liquid, a plurality of server clusters each server cluster having a plurality of server assemblies that incorporate at least one respective liquid cooling unit, and a plurality of heat exchangers fluidly connected to the liquid cooling units of the plurality of server clusters via the liquid cooling loop. The heat exchangers configured to receive the heated cooling liquid discharged from the respective liquid cooling units and cool the received heated cooling liquid along with a pump fluidly coupled to the plurality of heat exchangers via the liquid cooling loop, wherein at least a portion of the liquid cooling loop comprises a serialized configuration that serially couples the server clusters and/or serially couples the server clusters and the heat exchangers.

    HYBRID LIQUID COOLING ARRANGEMENT FOR AUTONOMOUS AND IMMERSION COOLED RACKS

    公开(公告)号:US20240074118A1

    公开(公告)日:2024-02-29

    申请号:US18236498

    申请日:2023-08-22

    申请人: OVH

    IPC分类号: H05K7/20

    摘要: A datacenter rack assembly providing a liquid cooling arrangement to service an autonomous rack and an immersion cooling rack coexisting within the datacenter rack assembly is presented. The datacenter rack assembly comprises an autonomous rack containing at least one electronic processing assembly, an integrated heat exchanger, and at least one liquid cooling block while the immersion cooling rack comprises a dielectric immersion cooling fluid at least one electronic processing assembly immersed in the dielectric immersion cooling fluid, and at least one liquid cooling block. The datacenter rack assembly incorporates a liquid cooling distribution arrangement to control distribution of liquid for cooling of the autonomous and IC racks through various liquid flow distribution channel segments, temperature sensors, and communication-enabled flow control valves based on detected temperature conditions.

    HEAT SINK HAVING NON-STRAIGHT FINS FOR ORIENTING A FLOW OF AN IMMERSIVE COOLING FLUID

    公开(公告)号:US20220316816A1

    公开(公告)日:2022-10-06

    申请号:US17690833

    申请日:2022-03-09

    申请人: OVH

    IPC分类号: F28F3/02 F28D21/00

    摘要: A heat sink for collecting thermal energy from a heat generating component. The heat sink comprises a base comprising a thermal transfer surface configured to be placed in thermal contact with the heat-generating component, an external surface opposite from the thermal transfer surface and an inlet side of the base extending between an edge of the thermal transfer surface and an edge of the external surface and a plurality of fins extending from the external surface. The fins define a plurality of fin passages therebetween, at least one fin of the plurality of fins having non-straight longitudinal edges extending along the external surface and defining at least in part at least one non-straight fin passage.

    IMMERSION COOLING SYSTEM IMPLEMENTING A FIRST CONTAINER AND A SECOND CONTAINER

    公开(公告)号:US20240306345A1

    公开(公告)日:2024-09-12

    申请号:US18588638

    申请日:2024-02-27

    申请人: OVH

    IPC分类号: H05K7/20

    CPC分类号: H05K7/203 H05K7/20327

    摘要: Systems for cooling one or more electronic devices are disclosed, each of the one or more electronic devices including one or more heat-generating components. An immersion cooling includes a first container adapted for receiving a first heat-transfer liquid, the one or more electronic devices being, at least in part, immersed in the first heat-transfer liquid such that the first heat-transfer liquid collects, in use, at least a portion of a thermal energy generated by the one or more heat-generating components and a second container adapted for receiving a second heat-transfer liquid, the first container being, at least in part, immersed in the second container cooling system.

    IMMERSION-COOLED ELECTRONIC DEVICE AND COOLING MONITORING SYSTEM FOR IMMERSION-COOLED ELECTRONIC DEVICE

    公开(公告)号:US20240064932A1

    公开(公告)日:2024-02-22

    申请号:US18232865

    申请日:2023-08-11

    申请人: OVH

    IPC分类号: H05K7/20 G01M3/16 H02H5/08

    摘要: An electronic device and a cooling monitoring system for an electronic device receiving power from a power supply. The electronic device includes a board at least in part immersed in an immersion case comprising a first heat-transfer liquid for cooling of the electronic device, one or more sensors configured to measure an operating parameter of the first heat-transfer liquid, and a controller communicably connected to the one or more sensors, the controller being configured to receive signals from the one or more sensors and, in response to determining that the signals indicate that the operating parameter of the first heat-transfer liquid is above a threshold, cause to disconnect the electronic device from the power supply.

    RACK ASSEMBLY FOR A DATA CENTER AND METHOD FOR CONTROLLING COOLING FLUID IN A COOLING LOOP OF THE RACK ASSEMBLY

    公开(公告)号:US20230062986A1

    公开(公告)日:2023-03-02

    申请号:US17889972

    申请日:2022-08-17

    申请人: OVH

    IPC分类号: H05K7/20

    摘要: A rack assembly for a data center includes: a rack frame housing at least one heat-generating component; a heat exchanger defining a first internal fluid conduit; at least one liquid cooling block connected to the at least one heat-generating component, each of the at least one liquid cooling block defining a second internal fluid conduit, the second internal fluid conduit being in thermal connection with the first internal fluid conduit; a cooling loop independent from any sources of cooling fluid external to the rack assembly and comprising the first and second internal fluid conduits, the cooling loop transferring heat from the second internal fluid conduit to the first internal fluid conduit; and a fluid compensation system comprising a reservoir fluidly connected to the cooling loop and an actuating device to force cooling fluid from the reservoir to the cooling loop to compensate for loss of cooling fluid in the cooling loop.