Invention Publication
- Patent Title: POLYAMIC ACID RESIN AND POLYIMIDE FILM USING THE SAME
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Application No.: US18355068Application Date: 2023-07-19
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Publication No.: US20240034838A1Publication Date: 2024-02-01
- Inventor: Kyungil AHN , Dongyoun KIM , Dayeong YU , Jaehyun SHIM
- Applicant: DOOSAN CORPORATION
- Applicant Address: KR Seoul
- Assignee: DOOSAN CORPORATION
- Current Assignee: DOOSAN CORPORATION
- Current Assignee Address: KR Seoul
- Priority: KR 20220089284 2022.07.20
- Main IPC: C08G73/10
- IPC: C08G73/10 ; C08G77/26 ; C08J5/18

Abstract:
A polyamic acid resin is copolymerized including: at least one diamine; at least one acid dianhydride; and polyhedral oligomeric silsesquioxane, and a transparent polyimide film is formed using the polyamic acid resin. The transparent polyimide film secures both excellent optical and mechanical properties through organic-inorganic hybrid formation, thus being applicable as a cover window for display devices.
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