公开(公告)号：US20240034838A1

公开(公告)日：2024-02-01

申请号：US18355068

申请日：2023-07-19

Applicant: DOOSAN CORPORATION

Inventor： Kyungil AHN ,  Dongyoun KIM ,  Dayeong YU ,  Jaehyun SHIM

IPC: C08G73/10 ,  C08G77/26 ,  C08J5/18

CPC classification number: C08G73/106 ,  C08G73/1007 ,  C08G73/1078 ,  C08G77/26 ,  C08J5/18

Abstract: A polyamic acid resin is copolymerized including: at least one diamine; at least one acid dianhydride; and polyhedral oligomeric silsesquioxane, and a transparent polyimide film is formed using the polyamic acid resin. The transparent polyimide film secures both excellent optical and mechanical properties through organic-inorganic hybrid formation, thus being applicable as a cover window for display devices.

公开(公告)号：US20230309222A1

公开(公告)日：2023-09-28

申请号：US18023546

申请日：2021-10-18

Applicant: DOOSAN CORPORATION

Inventor： Euidock RYU ,  Sungmoon KIM ,  Jinwoo KIM ,  Subyung PARK ,  Dongho CHAE

IPC: H05K1/03 ,  H05K3/28 ,  H05K1/02

CPC classification number: H05K1/0393 ,  H05K3/281 ,  H05K1/0266 ,  H05K2203/0143 ,  H05K2203/1545 ,  H05K2203/166

Abstract: The present invention relates to a method for manufacturing a double access flexible printed circuit board, having excellent mass production and cost-reduction effects by a roll-to-roll (R2R) process throughout the entire process, and a double access flexible printed circuit board manufactured by the method.

公开(公告)号：US20230049939A1

公开(公告)日：2023-02-16

申请号：US17794064

申请日：2020-12-14

Applicant: DOOSAN CORPORATION

Inventor： Sungmoon KIM ,  Hyungrae ROH ,  Kwangseok PARK ,  Sanghwa KIM

IPC: H05K3/28 ,  B32B37/00 ,  B32B37/06 ,  B32B41/00 ,  B32B38/18 ,  B32B27/28 ,  B32B15/08 ,  B32B15/20 ,  B32B37/20 ,  B65H23/188

Abstract: A laminator is disclosed. The laminator includes a substrate supply part for supplying a substrate on which a metal pattern is formed; a coverlay supply part for supplying a film to which a plurality of coverlays is attached; a heating roller part for bonding the substrate and the film so that the plurality of coverlays respectively covers the metal pattern; a substrate tension adjustment part and a film tension adjustment part; a bonding state image photographing part for measuring an interval between the plurality of coverlays after the substrate and the film are bonded; and an adjustment part for adjusting the substrate tension adjustment part or the film tension adjustment part so that the interval between the plurality of coverlays measured by the bonding state image photographing part maintains a preset allowable interval.

公开(公告)号：US11407329B2

公开(公告)日：2022-08-09

申请号：US16545018

申请日：2019-08-20

Applicant: DOOSAN CORPORATION

Inventor： Jin Yong Lee

IPC: H02J7/00 ,  B60L58/24 ,  B60L15/00 ,  B60W20/13 ,  B60W10/26 ,  B60L50/50 ,  B60L58/26

Abstract: An apparatus for controlling vehicle motors based on a battery temperature includes: a battery temperature sensor unit for measuring a temperature of a battery pack of an industrial vehicle; a battery monitoring unit for monitoring a measured value of the temperature sensor unit, and for transmitting temperature information when the temperature of the battery pack is out of a reference value that is predetermined; a vehicle control unit for restricting driving of a motor that receives a power from the battery pack based on the temperature information; and a fan control unit for controlling driving of a fan that cools the battery pack based on the temperature information.

公开(公告)号：US20220017794A1

公开(公告)日：2022-01-20

申请号：US17418445

申请日：2019-08-23

Applicant: DOOSAN CORPORATION

Inventor： Taejin CHOI ,  Woojeong KIM

IPC: C09J11/04 ,  C09J163/00 ,  C09J11/06 ,  H01L23/00

Abstract: A non-conductive adhesive film for semiconductor packages and a method of manufacturing a semiconductor package using the non-conductive adhesive film are disclosed. The non-conductive adhesive film for semiconductor packages includes a base; and an adhesive layer disposed on one surface of the base and having a storage modulus in a range of 2 to 4 GPa at 25° C.

公开(公告)号：USD908305S1

公开(公告)日：2021-01-19

申请号：US29654729

申请日：2018-06-27

Applicant: DOOSAN CORPORATION

Designer： Samki Park ,  Jinhup Yeu ,  Dongchul Lee ,  Minki Kim ,  Yoojeung Lim ,  Eunsook Seo

公开(公告)号：USD907324S1

公开(公告)日：2021-01-05

申请号：US29691636

申请日：2019-05-17

Applicant: DOOSAN CORPORATION

Designer： Kyungjin Lee ,  Hak Hyun Lee

公开(公告)号：USD904722S1

公开(公告)日：2020-12-08

申请号：US29654734

申请日：2018-06-27

Applicant: DOOSAN CORPORATION

Designer： Yongseok Ryu ,  Jinhup Yeu ,  Dongchul Lee ,  Minki Kim ,  Yoojeung Lim ,  Eunsook Seo

公开(公告)号：US10850960B2

公开(公告)日：2020-12-01

申请号：US16060041

申请日：2015-12-08

Applicant: DOOSAN CORPORATION

Inventor： Dong Ho Han

IPC: B66F9/075 ,  B66F17/00 ,  F01P7/16 ,  F01P3/00 ,  F01P7/14

Abstract: The present invention is related to a cooling device for a forklift brake system, which is capable of maintaining a predetermined level of heat-radiation performance by reducing heat when heat is generated in a service brake that is provided at a forklift driving shaft. A cooling device for a forklift brake system according to an exemplary embodiment of the present invention allows cooling oil to bypass a cooler when a pressure of the cooling oil is abnormally increased or there is a concern that a pressure of the cooling oil is increased, thereby preventing the cooler from being damaged.

公开(公告)号：US10584239B2

公开(公告)日：2020-03-10

申请号：US16424251

申请日：2019-05-28

Applicant: DOOSAN CORPORATION

Inventor： Dong Hee Jung ,  Jeong Don Kwon ,  Moo Hyun Kim ,  Do Woong Hong

IPC: C08L71/02 ,  C08J5/24 ,  C08J5/04 ,  B32B27/28 ,  C08G65/48 ,  C08K3/28 ,  C08J5/08 ,  C08K9/06 ,  C08K5/00 ,  H05K3/02 ,  H05K1/03

Abstract: A thermosetting resin composition for use with high frequencies is provided. The composition includes: (a) a polyphenylene ether having two or more unsaturated substituent groups selected from the group consisting of the vinyl group and the allyl group at both ends of the molecular chain thereof, or an oligomer of said polyphenylene ether; (b) three or more different types of cross-linking curing agents; and (c) a flame retardant. It is possible to provide a printed circuit board for use with high frequencies which simultaneously exhibits, inter alia, an outstanding low dielectric loss characteristic and good moisture-absorption heat resistance, low thermal expansion characteristics, thermal stability and outstanding working properties.