发明公开
- 专利标题: Sensing Substrate, Manufacturing Method therefor and Electronic Apparatus
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申请号: US17761590申请日: 2021-05-31
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公开(公告)号: US20240044730A1公开(公告)日: 2024-02-08
- 发明人: Lin GONG , Yue LI , Wenbo CHANG , Yuelei XIAO , Xue CAO , Xuechao SONG , Yi ZHOU , Kidong HAN , Baijun ZHOU , Feng QU , Yifan WU
- 申请人: Beijing BOE Sensor Technology Co., Ltd. , BOE Technology Group Co., Ltd.
- 申请人地址: CN Beijing
- 专利权人: Beijing BOE Sensor Technology Co., Ltd.,BOE Technology Group Co., Ltd.
- 当前专利权人: Beijing BOE Sensor Technology Co., Ltd.,BOE Technology Group Co., Ltd.
- 当前专利权人地址: CN Beijing
- 国际申请: PCT/CN2021/097344 2021.05.31
- 进入国家日期: 2022-12-08
- 主分类号: G01L1/22
- IPC分类号: G01L1/22 ; G01K1/024 ; G01K1/14
摘要:
A sensing substrate and a manufacturing method thereof are provided. The sensing substrate includes a base substrate, a heat electrode and a strain detection electrode which are disposed on the base substrate, and an insulation layer covering the heat electrode and the strain detection electrode. The heat electrode is configured for heating, and the strain detection electrode is configured to detect strain. The heat electrode and the strain detection electrode each have a metal mesh structure.
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