Invention Publication
- Patent Title: Sensing Substrate, Manufacturing Method therefor and Electronic Apparatus
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Application No.: US17761590Application Date: 2021-05-31
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Publication No.: US20240044730A1Publication Date: 2024-02-08
- Inventor: Lin GONG , Yue LI , Wenbo CHANG , Yuelei XIAO , Xue CAO , Xuechao SONG , Yi ZHOU , Kidong HAN , Baijun ZHOU , Feng QU , Yifan WU
- Applicant: Beijing BOE Sensor Technology Co., Ltd. , BOE Technology Group Co., Ltd.
- Applicant Address: CN Beijing
- Assignee: Beijing BOE Sensor Technology Co., Ltd.,BOE Technology Group Co., Ltd.
- Current Assignee: Beijing BOE Sensor Technology Co., Ltd.,BOE Technology Group Co., Ltd.
- Current Assignee Address: CN Beijing
- International Application: PCT/CN2021/097344 2021.05.31
- Date entered country: 2022-12-08
- Main IPC: G01L1/22
- IPC: G01L1/22 ; G01K1/024 ; G01K1/14

Abstract:
A sensing substrate and a manufacturing method thereof are provided. The sensing substrate includes a base substrate, a heat electrode and a strain detection electrode which are disposed on the base substrate, and an insulation layer covering the heat electrode and the strain detection electrode. The heat electrode is configured for heating, and the strain detection electrode is configured to detect strain. The heat electrode and the strain detection electrode each have a metal mesh structure.
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