A semiconductor package includes a redistribution wiring layer having a first surface and a second surface opposite to the first surface, a conductive bump on the first surface, and a first semiconductor device on the conductive bump. The redistribution wiring layer includes redistribution wirings having an uppermost redistribution wiring, a bonding pad, and an uppermost insulating layer. The uppermost redistribution wiring has a redistribution via and a redistribution line on the redistribution via. The bonding pad disposes on the redistribution line of the uppermost redistribution wiring, and the conductive bump is disposed on the bonding pad. The uppermost insulating layer overlapping (e.g., covering) the uppermost redistribution wiring and having an opening exposing a portion of the bonding pad.